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Photosensitive resin composition

A resin composition and photosensitivity technology, applied in optics, photosensitive materials for optomechanical equipment, optomechanical equipment, etc., can solve the problem of film remaining rate decrease, achieve excellent performance, low dielectric constant, coating Excellent effect

Inactive Publication Date: 2008-05-14
MERCK PATENT GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the inventors of the present invention have found through research that although the problem of whitening of the film surface can be solved by this method, a new problem of a decrease in the film remaining rate during the developing process has arisen.

Method used

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  • Photosensitive resin composition
  • Photosensitive resin composition
  • Photosensitive resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0073] Hereinafter, although an Example demonstrates this invention more concretely, the form of this invention is not limited to these Examples.

Synthetic example 1

[0074] Synthesis Example 1 (Synthesis of Acrylic Copolymer 1)

[0075] In a 2000ml four-necked flask equipped with a stirrer, a condenser tube, a thermometer, and a nitrogen inlet tube, add 700 g of propylene glycol monomethyl ether acetate, 171 g of methyl methacrylate, 90 g of 2-hydroxypropyl methacrylate, and Acrylic acid 39g, dimethyl-2,2'-azobis (2-methylpropionate) 8.0g, and stirred, while nitrogen gas was passed through, the temperature was raised, and polymerized at 85°C for 8 hours to obtain heavy Acrylic copolymer 1 with an average molecular weight of 21,000.

Embodiment 1

[0077] 100 parts by weight of the acrylic copolymer 1 prepared in Synthesis Example 1, 25 parts by weight of an ester compound represented by the following formula (V) (the esterification rate is 50%), and 5 parts by weight of the phenolic compound represented by the above formula (III) Compound, 17 parts by weight of epoxy group-containing curing agent Techmoa VG3101L (produced by Mitsui Chemicals (KK)) and 0.5 parts by weight of monooctyl maleate are dissolved in propylene glycol monomethyl ether acetate / diglyme ( 80 / 20), in order to prevent radial creases on the resist film during spin coating, that is, so-called striations, 300 ppm of fluorine-based surfactant Megafac R-08 (manufactured by Dainippon Inki Chemical Industry Co., Ltd.) was further added. ), and stirred, and then filtered through a 0.2 μm filter to prepare the photosensitive resin composition 1 of the present invention.

[0078]

[0079]

[0080] The photosensitive resin composition 1 prepared above was spi...

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Abstract

The present invention relates to a photosensitive resin composition, which has two functions of suppressing the whitening of the film surface and suppressing the reduction of the remaining rate of the film. The photosensitive resin composition includes an alkali-soluble resin, a photosensitizer having a quinonediazide group, and a curing agent , the alkali-soluble resin is an acrylic resin, the curing agent is a curing agent containing an epoxy group, and the photosensitive resin composition further contains a polycarboxylic acid whose melting point is below 20° C. and a part of a plurality of carboxyl groups is esterified by a higher alcohol An ester compound, and a flat display panel or a semiconductor device having a planarizing film or an interlayer insulating film formed using the photosensitive resin composition. As said polycarboxylate compound, the compound which consists of an aliphatic unsaturated dicarboxylic acid is preferable.

Description

technical field [0001] The present invention relates to a photosensitive resin composition, and more specifically, to a photosensitive resin composition suitable for use in the manufacture of semiconductor devices, flat panel displays (FPDs), etc. A photosensitive resin composition; an FPD and a semiconductor device formed using the photosensitive resin composition; and a method of forming a heat-resistant film using the above photosensitive resin composition. Background technique [0002] In a wide range of fields, including the manufacture of semiconductor integrated circuits such as LSIs and display panels of FPDs, and the manufacture of circuit boards such as thermal heads, etc., photolithography has traditionally been used to form fine elements and perform microfabrication. Also, in photolithography, since a resist pattern is formed, a positive or negative photosensitive resin composition is used. In recent years, as a new application of these photosensitive resin comp...

Claims

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Application Information

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IPC IPC(8): G03F7/004G03F7/022
CPCG03F7/0226G03F7/0007G03F7/038G03F7/008
Inventor 栗原清二绪方智成高桥修一张勇
Owner MERCK PATENT GMBH