Suspension board with circuit and producing method thereof

A suspension substrate and circuit technology, which is applied in the manufacture of metal core circuits, reinforcement of conductive patterns, and secondary processing of printed circuits. Effects of simple manufacturing, reduced manufacturing man-hours, and simplified structure

Active Publication Date: 2008-05-28
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, in order to meet the requirements of miniaturization, the head slider must be formed relatively small, and since the magnetic head is provided, it is difficult to install other components in space.
Therefore, if it is desired to instal

Method used

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  • Suspension board with circuit and producing method thereof
  • Suspension board with circuit and producing method thereof
  • Suspension board with circuit and producing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0158] Embodiment 1 (A form in which a light guiding path is provided on a substrate insulating layer)

[0159] A metal support substrate made of stainless steel with a thickness of 20 μm was prepared (see FIG. 4( a )).

[0160] Next, an insulating base layer made of polyimide resin was formed on the metal supporting board using the above-mentioned pattern. The thickness of the substrate insulating layer was 10 µm.

[0161] Next, by an additive method, a conductor pattern made of copper, a supply wiring, and a supply terminal portion were simultaneously formed. The thickness of these is 10 μm.

[0162] Next, a cover insulating layer made of polyimide resin was formed on the base insulating layer using the above-mentioned pattern. The thickness of the insulating cover layer is 5 μm. In this manner, the base insulating layer, the conductor pattern, and the cover insulating layer are sequentially laminated on the metal supporting substrate (see FIG. 4( b )).

[0163] Next, a...

Embodiment 2

[0176] Embodiment 2 (a form in which a light guide path is provided on a cover insulating layer)

[0177] In Example 2, a light guide path is provided on the insulating cover layer, and a light-emitting element is provided on the insulating cover layer. In the same manner as in Example 1, a suspension board with a circuit is manufactured (refer to FIGS. 7).

[0178] That is, the cover insulating layer is formed such that its outer peripheral edge is substantially at the same position as the outer peripheral edge of the base insulating layer in plan view (see FIG. 7( b )).

[0179] In addition, the light guide path is formed so that it overlaps with the first wiring on the cover insulating layer in the wiring part and the external connection part of the universal joint part, and in the terminal forming part, faces the first wiring part on the cover insulating layer. Offset on the other side in the width direction. In addition, a light emitting element is provided on the insul...

Embodiment 3

[0180] Embodiment 3 (a form in which the substrate insulating layer also serves as the lower cladding layer, and the cover insulating layer also serves as the upper cladding layer)

[0181] A metal support substrate made of stainless steel with a thickness of 20 μm was prepared (see FIG. 8( a )).

[0182] Next, an insulating base layer made of polyimide resin was formed on the metal supporting board in the above-mentioned pattern. The refractive index of the substrate insulating layer at a wavelength of 830 nm was 1.541. In addition, the thickness of the insulating substrate layer was 6 μm (see FIG. 8( b )).

[0183] Next, by an additive method, a conductor pattern made of copper, a supply wiring, and a supply terminal portion were simultaneously formed on the insulating substrate layer (see FIG. 8(c)). The thickness of these is 10 μm.

[0184] Next, a core layer is formed on the substrate insulating layer.

[0185] In order to form the core layer with the above pattern, f...

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Abstract

A suspension board with circuit includes a metal supporting board, an insulating base layer formed on the metal supporting board, a conductive pattern formed on the insulating base layer, an insulating cover layer formed on the insulating base layer so as to cover the conductive pattern, and an optical waveguide.

Description

[0001] Interrelationship with related applications [0002] This application claims the priority of Japanese Patent No.2006-314149 filed on November 21, 2006 and Japanese Patent No.2007-199996 filed on July 31, 2007, and the disclosure content is included in this application as it is . technical field [0003] The present invention relates to a suspension board with a circuit and a manufacturing method thereof, and more particularly to a suspension board with a circuit mounted on a hard disk drive using a light-assisted method and a manufacturing method thereof. Background technique [0004] In recent years, a light-assisted method (light-assisted magnetic recording method) has been known as a magnetic recording method for hard disks and the like. In this method, when information is recorded, the hard disk is heated by light irradiation, and the coercive force is lowered. , Using a magnetic head to record, by doing so, it is possible to record information at a high density ...

Claims

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Application Information

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IPC IPC(8): G11B5/48G11B11/105H05K3/24H05K3/44
CPCG11B5/484G11B5/4866G11B21/21
Inventor 十二纪行宗和范S·R·卡安内藤俊树青木丰
Owner NITTO DENKO CORP
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