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Curable resin composition and cured object thereof

A curable resin and composition technology, applied in instruments, photosensitive materials for optomechanical equipment, optics, etc., can solve the problems of electrical corrosion, poor operation of electronic machines, bursting, etc., and achieve less gasification components, Realization of low linear expansion and low water absorption

Active Publication Date: 2011-11-16
TAIYO HLDG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this system, the water absorption rate of the coating film is 1.2 to 1.5% by mass, and cracking due to water absorption and electrical corrosion caused by moisture in the coating film are problems.
In addition, polybasic acid anhydrides and photopolymerization initiators released from the resin at high temperatures vaporize and cause malfunctions in electronic equipment.

Method used

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  • Curable resin composition and cured object thereof
  • Curable resin composition and cured object thereof
  • Curable resin composition and cured object thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0074] Next, the present invention will be specifically described below by showing examples and comparative examples of the present invention, but the present invention is not limited to the following examples. In addition, "parts" and "%" mean "parts by mass" and "% by mass" unless otherwise specified.

Synthetic example 1

[0075] (synthesis of carboxyl group-containing copolymer resin A)

[0076] 900 g of diethylene glycol dimethyl ether, and 21.4 g of tert-butyl peroxide 2-ethylhexanoate were added to a 2-liter separable flask with a stirrer, thermometer, reflux condenser, dropping funnel, and nitrogen inlet tube Esters [PERBUTYL O manufactured by NOF Corporation], after heating up to 90°C, 309.9g of methacrylic acid, 116.4g of methyl methacrylate, and 109.8g of lactones represented by general formula (I) were converted into 2-Hydroxyethyl methacrylate [Placcel FM1 manufactured by DAICEL CHEMICAL INDUSTRIES, LTD.] was added dropwise with 21.4 g of bis(4-tert-butylcyclohexyl) peroxydicarbonate [PEROYL TCP manufactured by NOF Corporation] In diethylene glycol dimethyl ether, aging was further performed for 6 hours to obtain a carboxyl group-containing copolymer resin (A) solution. The reaction was carried out under nitrogen atmosphere.

[0077] Next, 363.9 g of 3,4-epoxycyclohexylmethyl acryla...

Embodiment 1～4 and comparative example 1

[0081] The ingredients shown in Table 1 using the A-1 varnish and the R-1 varnish obtained in the above synthesis example were kneaded with a three-roll mill to obtain a curable resin composition. Table 2 shows the property evaluation results of each curable composition.

[0082] Table 1

[0083]

[0084] Table 2

[0085]

[0086]

[0087] * : Inking failed at high filling.

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PUM

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Abstract

A curable resin composition which contains an inorganic filler in a high concentration. It can easily attain a reduced coefficient of thermal expansion, increased coefficient of thermal conductivity, reduced water absorption, etc. The composition can be developed with a dilute aqueous alkali solution. It is reduced in the content of gasifiable components to be released at high temperatures from organic ingredients including the resin. The resin composition is an alkali-developable insulating resin composition comprising (A) a carboxylated copolymer resin, (B) a compound having two or more reactive groups which cure by the action of actinic energy rays, (C) a photopolymerization initiator, and (D) an inorganic filler, the content of the inorganic filler (D) being 65 mass% or higher based on the solid ingredients.

Description

technical field [0001] The present invention relates to a curable resin composition capable of being developed with a dilute alkaline aqueous solution and a cured product thereof filled with an inorganic filler at a high concentration. More specifically, the present invention relates to a curable resin composition capable of easily achieving low linear expansion and high thermal conductivity by filling an inorganic filler at a high concentration, and its cured product. Low water absorption, etc., at high temperature, there are few vaporized components released from organic components such as resins, and it can be developed by dilute alkaline aqueous solution. Background technique [0002] In recent years, along with miniaturization and higher performance of electronic equipment, higher density and higher functionality of semiconductors have been demanded. Therefore, circuit boards on which semiconductors are mounted are also required to be small and high-density circuit boa...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/033C08L33/14G03F7/004
CPCG03F7/033G03F7/0047C08L63/00C08L33/02
Inventor 大胡义和峰岸昌司糸川弦
Owner TAIYO HLDG CO LTD
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