The invention relates to a black hot-melt adhesive tape and its preparation process and application. The black hot-melt adhesive tape includes a release layer and an adhesive film layer; the upper surface of the release layer is coated with an adhesive film layer, and the adhesive film includes the following components in parts by weight: Polyamide resin 67-74, polyurethane resin 6-9, tackifying resin 4-6, thermal conductive filler 0.3-0.7, thixotropic agent 5-9, antioxidant 0.4-0.6, carbon black 7-13; its preparation process includes the following Steps: S1, extruding and blending polyamide resin, polyurethane resin and carbon black; S2, blending polyamide with carbon black in S1, polyurethane blending modified rubber particles and tackifying resin, thermally conductive filler, thixotropic Extrusion and blending of additives and antioxidants; S3, heating and melting the blended rubber particles, coating the melted film on a release paper, cooling and drying on a water cooling roller, and obtaining a black hot-melt tape. The adhesive tape of the invention can effectively reduce laser penetration energy and protect chips.