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A kind of black hot-melt adhesive tape and its preparation process and application

A technology of hot-melt tape and preparation process, which is applied in adhesives, heat-activated films/sheets, recording carriers used by machines, etc., can solve problems such as chip damage, reduce enterprise operating costs, improve laser barrier performance, and strengthen overall use performance effect

Active Publication Date: 2021-06-29
天津伟景诺兰达科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, various telecom operators require laser coding on the back of the card, which often causes the laser to penetrate the PVC card body layer and damage the chip in the module.

Method used

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  • A kind of black hot-melt adhesive tape and its preparation process and application
  • A kind of black hot-melt adhesive tape and its preparation process and application
  • A kind of black hot-melt adhesive tape and its preparation process and application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] The present embodiment provides a kind of black hot-melt adhesive tape, comprises release layer and adhesive film layer; The upper surface of release layer is coated with adhesive film layer, and the thickness of adhesive film layer is 40 μ m, and adhesive film comprises following components by weight:

[0034]

[0035] Thermally conductive fillers are calcium carbonate and talcum powder.

[0036] The thixotropic agent is fumed silica.

[0037] The antioxidant is Antioxidant 1010.

[0038] The release layer is release paper, and the material of the release paper is double-sided silicone oil glassine paper.

[0039] The preparation technology of black hot-melt adhesive tape, comprises the steps:

[0040] S1. Blend the polyamide resin, polyurethane resin and carbon black in a twin-screw extruder first, the extrusion temperature is 140°C, and the screw speed of the twin-screw extruder is 20r / min, so that the carbon black is in the rubber particle system Evenly disper...

Embodiment 2

[0044] The present embodiment provides a kind of black hot-melt adhesive tape, comprises release layer and adhesive film layer; The upper surface of release layer is coated with adhesive film layer, and the thickness of adhesive film layer is 60 μ m, and adhesive film comprises following components by weight:

[0045]

[0046] The thermally conductive filler is zinc oxide.

[0047] Thixotropic agents are talc and paraffin.

[0048] The antioxidant is Antioxidant 1010.

[0049] The release layer is release paper, and the material of the release paper is double-sided silicone oil glassine paper.

[0050] The preparation technology of black hot-melt adhesive tape, comprises the steps:

[0051] S1. Blend the polyamide resin, polyurethane resin and carbon black in a twin-screw extruder first, the extrusion temperature is 160°C, and the screw speed of the twin-screw extruder is 30r / min, so that the carbon black is in the rubber particle system Evenly dispersed;

[0052] S2, t...

Embodiment 3

[0055] The present embodiment provides a kind of black hot-melt adhesive tape, comprises release layer and adhesive film layer; The upper surface of release layer is coated with adhesive film layer, and the thickness of adhesive film layer is 80 μ m, and adhesive film comprises following components by weight:

[0056]

[0057] The thermally conductive fillers are barium oxide and barium sulfate.

[0058] The thixotropic agent is rosin resin.

[0059] The antioxidant is Antioxidant 1010.

[0060] The release layer is release paper, and the material of the release paper is double-sided silicone oil glassine paper.

[0061] The preparation technology of black hot-melt adhesive tape, comprises the steps:

[0062] S1. Blend the polyamide resin, polyurethane resin and carbon black in a twin-screw extruder first, the extrusion temperature is 180°C, and the screw speed of the twin-screw extruder is 40r / min, so that the carbon black is in the rubber particle system Evenly dispers...

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Abstract

The invention relates to a black hot-melt adhesive tape and its preparation process and application. The black hot-melt adhesive tape includes a release layer and an adhesive film layer; the upper surface of the release layer is coated with an adhesive film layer, and the adhesive film includes the following components in parts by weight: Polyamide resin 67-74, polyurethane resin 6-9, tackifying resin 4-6, thermal conductive filler 0.3-0.7, thixotropic agent 5-9, antioxidant 0.4-0.6, carbon black 7-13; its preparation process includes the following Steps: S1, extruding and blending polyamide resin, polyurethane resin and carbon black; S2, blending polyamide with carbon black in S1, polyurethane blending modified rubber particles and tackifying resin, thermally conductive filler, thixotropic Extrusion and blending of additives and antioxidants; S3, heating and melting the blended rubber particles, coating the melted film on a release paper, cooling and drying on a water cooling roller, and obtaining a black hot-melt tape. The adhesive tape of the invention can effectively reduce laser penetration energy and protect chips.

Description

technical field [0001] The invention relates to the technical field of adhesive materials, in particular to a black hot-melt adhesive tape and its preparation process and application. Background technique [0002] At present, in the production process of dual-interface bank cards, mobile phone SIM cards, and ordinary contact IC cards in China, transparent hot-melt adhesive films are used to complete the bonding of IC modules and card bodies. As the size requirements of mobile phones for SIM cards are getting smaller and smaller, from the original 2FF to 3FF to 4FF standards, and the overall thickness requirements for SIM cards are also getting thinner and thinner, the thickness of the card body is reduced from 0.8mm to 0.72mm thick. At present, various telecom operators require laser coding on the back of the card, which often causes the laser to penetrate the PVC card body layer and damage the chip in the module. For this reason, it is of great significance to propose a b...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J7/10C09J7/35C09J177/00C09J175/04C09J11/04C09J11/08G06K19/077
CPCC08K2003/2206C08K2003/2296C08K2003/265C08K2003/3045C09J11/04C09J11/08C09J175/04C09J177/00C09J7/10C09J7/35C09J2301/304G06K19/07722C08L75/04C08L57/02C08K3/04C08K3/26C08K3/34C08K3/22C08K3/30
Inventor 韩贵麟
Owner 天津伟景诺兰达科技有限公司
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