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Grid pressure sensing chip and preparation method, pressure distributed sensor

A distributed sensor and sensor chip technology, applied in the measurement of the property force of piezoelectric resistance materials, fluid pressure measurement by changing ohmic resistance, instruments, etc., can solve the problem that pressure sensors cannot detect pressure distribution and are inconvenient to operate. , large size and other problems, to achieve the effect of light weight, simple and convenient operation, small size

Inactive Publication Date: 2008-07-09
XI AN JIAOTONG UNIV
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  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to solve the shortcomings of traditional pressure sensors that cannot detect the pressure distribution on a certain contact surface, large volume, heavy weight, and inconvenient operation; , micromechanical electronic system] process preparation method, the further purpose is to provide a pressure distributed sensor combined with the sensor chip

Method used

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  • Grid pressure sensing chip and preparation method, pressure distributed sensor
  • Grid pressure sensing chip and preparation method, pressure distributed sensor
  • Grid pressure sensing chip and preparation method, pressure distributed sensor

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Embodiment Construction

[0022] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments.

[0023] As shown in Fig. 1 and Fig. 2, a grid pressure sensing chip includes an insulating bottom layer 1 and an insulating upper layer 8, and a row electrode framework layer 2 and a column electrode framework layer 6 are arranged between the insulating bottom layer 1 and the insulating upper layer 9; Four row electrodes 3 are arranged at equal intervals in the row electrode framework layer 2, and four column electrodes 7 are arranged at equal intervals in the column electrode framework layer 6. The row electrodes 3 and the column electrodes 7 form a grid distribution, and the row and column electrodes 3, 7 extends to both sides of the respective structure layers to form row and column electrode external contacts 9 and 9' respectively; an intermediate layer 4 is arranged between the row electrode structure layer 2 and the column electrode struct...

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Abstract

The invention discloses a grid pressure sensing chip and a preparation method thereof, and a pressure distribution sensor. The grid pressure sensing chip comprises an insulating bottom layer, an upper layer, and a row and a column electrode configuration layer arranged between the insulating bottom layer and the upper layer, wherein a plurality of row electrodes are arranged in the row electrode configuration layer; a plurality of column electrodes are arranged in the column electrode configuration layer to form a grid distribution together with the row electrodes; an intermediate layer is arranged between the row and the column electrode configuration layers; a plurality of pressure sensitive bodies are arranged in the intermediate layer just at the cross points of the row and the column electrodes; each pressure sensitive body is respectively connected with one row electrode and one column electrodes at two end faces thereof; and the insulating bottom layer, the upper layer, the row and the column electrode configuration layer and the intermediate layer integrally form a rectangular sheet. The pressure distribution sensor comprises a frame, a plurality of grid pressure sensing chip spliced in the frame, and electrode connection structures arranged on inner two sides of the frame. The inventive grid pressure sensing chip and the sensor can conveniently detect the pressure distribution on a local contact surface.

Description

technical field [0001] The invention relates to a flexible film grid pressure sensing chip and a preparation method thereof, and a pressure distributed sensor for detecting the pressure distribution on a certain local contact surface combined with the pressure sensing chip. Background technique [0002] The detection principle of the pressure sensor is based on the elastic compression deformation of the pressure-sensitive material caused by the external pressure, so that its resistance changes (piezoresistive effect), and the external pressure is measured by measuring the change in the resistance of the pressure-sensitive material. Pressure sensors are widely used in aerospace, military industry, automobiles, ships, and medical and health fields, and are playing an increasingly important role. However, in some special occasions, it is sometimes necessary to detect the pressure distribution on a certain local contact surface, such as detecting the pressure distribution of a c...

Claims

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Application Information

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IPC IPC(8): G01L1/18G01L9/06B81B7/00B81C1/00
Inventor 赵玉龙周高峰蒋庄德赵立波王新波
Owner XI AN JIAOTONG UNIV
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