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Auxiliary material for laminating flexible circuit board and laminating process thereof

A flexible circuit board and auxiliary material technology, which is applied to printed circuit components, secondary processing of printed circuits, and layered products, etc. Improved glue suppression and guaranteed high quality results

Inactive Publication Date: 2008-07-23
周伟
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Its disadvantages are: in the high-temperature release film, TEFLON (polytetrafluoroethylene) has insufficient ductility and softness, and the ability to inhibit the outflow of flexible circuit board glue, that is, the ability to inhibit the glue is also insufficient.
BOPP (biaxially oriented polypropylene), BOPA (biaxially oriented polynylon) and BOPET (biaxially oriented polyester) films will be severely deformed due to high temperatures during lamination at temperatures above 170 degrees Celsius, and their The separation of the lamination auxiliary material and the circuit board, that is, the release property, is also insufficient
The TPX (poly-4-methylpentene) film contains plastic additives, and in the lamination process above 180 degrees Celsius, the circuit board often leaves a residue separated from the TPX (poly-4-methylpentene) film. Additive residue, which in turn reduces yield in subsequent board processing

Method used

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  • Auxiliary material for laminating flexible circuit board and laminating process thereof
  • Auxiliary material for laminating flexible circuit board and laminating process thereof

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0024] Example 1: Laminating example of single-sided flexible circuit board 6:

[0025] Lay the separator 1, the high temperature resistant mold release film 2, the deformation maintenance material 3, the filling and coating material 4, the high temperature resistant mold release film 2, the circuit board protective film 5, the flexible circuit board, and the high temperature resistant mold release film 2 in order. 10 units are stacked, and the single-sided flexible circuit board 6 is obtained by pressing with a pressing machine for 2 hours under the conditions of 180° C., negative pressure and board surface pressure of 18 kg / cm 2.

[0026] The high temperature resistant mold release film 2 is a polyperfluoroethylene propylene film with a thickness of 0.025 mm.

[0027] The filling and coating material 4 is a HDPE film with a thickness of 0.1 mm.

[0028] The deformation maintaining material 3 is made of kraft paper with a weight of 180 grams.

[0029] The isolation plate 1 is a s...

example 2

[0030] Example 2: Laminating example of single-sided flexible circuit board 6:

[0031] Lay the separator plate 1, the high temperature resistant mold release film 2, the filling and coating material 4, the high temperature resistant mold release film 2, the circuit board protective film 5, the flexible circuit board, and the high temperature resistant mold release film 2 into 12 units in sequence. , The single-sided flexible circuit board 6 is produced by pressing with a pressing machine under the conditions of 180°C, negative pressure and board surface pressure of 18 kg / cm 2 for 2 hours.

[0032] The high temperature resistant mold release film 2 is a polyperfluoroethylene propylene film with a thickness of 0.02 mm.

[0033] The filling and coating material 4 is a HDPE film with a thickness of 0.1 mm.

[0034] The isolation plate 1 is a stainless steel plate with high hardness and low thermal expansion coefficient with a thickness of 1 mm.

example 3

[0035] Example 3: Laminating example of single-sided flexible circuit board 6:

[0036] Lay the separator plate 1, the high temperature resistant mold release film 2, the filling and coating material 4, the high temperature resistant mold release film 2, the circuit board protective film 5, the flexible circuit board, and the high temperature resistant mold release film 2 in order. , The single-sided flexible circuit board 6 is produced by pressing with a pressing machine for 50 seconds under the conditions of 180° C., negative pressure and board surface pressure of 18 kg / cm 2.

[0037] The high temperature resistant mold release film 2 is a polyperfluoroethylene propylene film with a thickness of 0.015 mm.

[0038] The filling and coating material 4 is a HDPE film with a thickness of 0.1 mm.

[0039] The isolation plate 1 is a stainless steel plate with high hardness and low thermal expansion coefficient with a thickness of 1 mm.

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Abstract

The invention provides an auxiliary material used for the lamination of a flexible circuit board and a lamination process thereof. The auxiliary material used for the lamination at least comprises a high temperature resistance demoulding film, a filling coating material and a high temperature resistance demoulding film which are sequentially tiled and overlapped; wherein, the high temperature resistance demoulding film is a polyfluorinated ethylene propylene plastic film. The lamination process of a flexible circuit board is that the auxiliary material used for the lamination is sequentially tiled and overlapped for one or a plurality of units and then pressed by a press. The polyfluorinated ethylene propylene plastic film is taken as the high temperature resistance demoulding film, which can reduce the content of the residue on the circuit board after demoulding and improves the quality of the circuit board.

Description

Technical field [0001] The invention relates to an auxiliary material for lamination of a flexible circuit board and a lamination process Background technique [0002] The lamination process of single-sided flexible circuit boards commonly used in the prior art is: separating board, high temperature resistant release film, deformation maintenance material such as kraft paper, filling and coating material such as PE film or silicone rubber, high temperature resistant release Films, circuit board protective films, insulators with conductive lines, high-temperature release films, and isolation plates are laid out layer by layer to form the unit as shown in the figure, and one or more units are repeatedly laid. At a certain vacuum and temperature , Under pressure, use a press to press the protective film tightly on the flexible circuit board with conductor lines, and with the help of the semi-cured glue on the reverse side of the protective film, the protective film, the circuit and ...

Claims

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Application Information

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IPC IPC(8): B32B27/06B32B5/00H05K1/02H05K3/22
Inventor 周伟
Owner 周伟