Round tube type micro-mortise heat tube using carbon nano-tube suspending liquid as working medium

A technology of carbon nanotubes and suspensions, which is applied in the field of devices in the field of nanotechnology, can solve problems such as not being retrieved, and achieve the effects of increasing maximum power, reducing total thermal resistance, and improving heat transfer coefficient

Inactive Publication Date: 2008-07-30
SHANGHAI JIAO TONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

So far, all heat pipe working fluid improvements have focused on metals and their oxide nanoparticles, and no literature has been found that carbon nanotube suspensions are used as microchannel heat pipe working fluids.

Method used

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  • Round tube type micro-mortise heat tube using carbon nano-tube suspending liquid as working medium

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Embodiment Construction

[0018] The embodiments of the present invention are described in detail below in conjunction with the accompanying drawings: this embodiment is implemented on the premise of the technical solution of the present invention, and detailed implementation methods and specific operating procedures are provided, but the protection scope of the present invention is not limited to the following the described embodiment.

[0019] As shown in FIG. 1 , in this embodiment, the entire circular tube-type micro-groove heat pipe is formed by processing the condensation section 1 , the heat insulation section 3 , and the evaporation section 7 with copper tubes.

[0020] The outer diameter of the copper tube is 8mm, the wall thickness is 0.6mm, the channel width is 0.25mm, the rib width is 0.1mm, the channel depth is 0.2mm, the number of channels is 60, the total length is 350mm, the length of the heating section is 100mm, and the length of the insulation section is 100mm. The condensation secti...

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Abstract

The invention relates to a circular pipe type microgroove path heat pipe which uses carbon nanometer pipe suspending liquid as work medium and comprises an evaporation zone, a heat insulation zone and a condensation zone, wherein, the evaporation zone, the heat insulation zone and the condensation zone are successively connected with each other in order. The carbon nanometer pipe suspending liquid is injected in the evaporation zone as the work medium, and the filled liquid rate of the carbon nanometer pipe suspending liquid is from 40 percent to 60 percent. The evaporation zone utilizes an electric heater to heat, and a teflon rod is sheathed outside the heat insulation zone for the heat preservation. A cooling water jacket is welded outside the condensation zone and is cooled by using cooling water to wash. Compared with the previous heat pipe which uses pure water as the work medium, the microgroove path heat pipe of the invention, which uses the carbon nanometer pipe suspending liquid as the work medium, can most increase the heat exchange coefficient of the evaporation zone by 90 percent. Besides, the total thermal resistance of the heat pipe can be reduced by about half, and the biggest power of the heat pipe can be increased by about 30 percent.

Description

technical field [0001] The invention relates to a device in the field of nanotechnology, in particular to a circular tube type micro-groove heat pipe using carbon nanotube suspension as a working medium. Background technique [0002] With the high frequency and high speed of electronic devices, the rapid development of integrated circuit technology and the advancement of MEMS (micro-electromechanical system) technology, as well as the development of various electronic devices and equipment towards high performance, miniaturization and miniaturization, electronic components The total power density of the device has increased significantly while the physical size has become smaller and smaller, and the heat flux has also increased. Whether the heat generated by these electronic components can be dissipated in a timely and effective manner will directly affect the cost of the electronic device. , work performance and reliability. The high temperature environment will inevitabl...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F28D15/02
Inventor 刘振华赵杰杨雪飞吕伦春鲍然
Owner SHANGHAI JIAO TONG UNIV
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