Semiconductor module, method for manufacturing the semiconductor module and portable device carrying the same

Abstract

The invention provides a semiconductor module, a manufacturing method of the semiconductor module and a portable device. In a semiconductor module in which a metal plate, an insulating layer, and a circuit element are laminated by embedding the protrusion structure in an insulating layer, connection reliability between the protrusion structure and an electrode of the circuit element is improved. A semiconductor wafer is prepared in which semiconductor substrates having electrodes and a protective film on the surface are formed in a matrix. Next, on the surface of the semiconductor wafer (semiconductor substrate), an insulating layer is sandwiched between the semiconductor substrate and a copper plate integrally formed with a protrusion and having a groove near it. After performing such clamping, the semiconductor substrate, the insulating layer, and the copper plate are integrated by press forming with a press device. Accordingly, the protrusion penetrates through the insulating layer, and the protrusion and the electrode are electrically connected. At the same time, the excess insulating layer squeezed out by the protrusions flows into the grooves.

Description

technical field [0001] The present invention relates to a semiconductor module and a method of manufacturing the same. Background technique [0002] Among conventional semiconductor modules, there is a semiconductor module called a CSP (Chip Size Package: chip size package). Such a CSP semiconductor module is formed by dicing and dividing a semiconductor wafer (semiconductor substrate) in which LSI (circuit elements) and external connection electrodes connected thereto are formed on one main surface. Therefore, the semiconductor module can be fixed on the wiring substrate with the same size as the LSI chip, so that the wiring substrate on the side where the semiconductor module is mounted can be miniaturized. [0003] In recent years, along with miniaturization and performance enhancement of electronic equipment, semiconductor modules used in electronic equipment have been required to be further miniaturized. With miniaturization of such a semiconductor module, it is essen...

AI Technical Summary

Problems solved by technology

[0005] In the state of the existing semiconductor wafer (semiconductor substrate), when the protrusion structure is buried in the insulating layer to laminate the metal plate, insulating layer and circuit elements, the fluidity of the insulating layer is low, especially in the semiconductor wafer. There are few discharge places for the resin extruded by the protrusion structure near the center, so there is a problem that the residual film of the resin is caught on the interface between the protrusion structure and the electrode of the circuit element facing it, and the connection reliability at the rewiring part is reduced.

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