Unlock instant, AI-driven research and patent intelligence for your innovation.

Soldering nozzle and apparatus using the same

A solder tip and solder ball technology, which is applied in the direction of tin feeding device, soldering equipment, soldering equipment, etc., can solve the problems of unstable control, decreased welding reliability, and difficult positioning of solder balls, etc., so as to improve soldering reliability and improve product quality. Quality, reduce the effect of bad welding phenomenon

Active Publication Date: 2008-08-06
SAE MAGNETICS (HK) LTD
View PDF1 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] However, with the laser nozzle 305 having the above-mentioned shape, since the position of the solder ball 303 is restricted only by the passing laser gas in the direction perpendicular to the column direction in which the solder recesses 351 are arranged (the ridge direction of the laser nozzle 305), , so the control over its position is still unstable
Furthermore, even in the column direction in which the solder recesses 351 are arranged, since the wall surface is a plane, the restriction on the position of the solder ball 303 as a spherical body is unstable.
Therefore, it is difficult to locate the solder ball 303 more accurately, and the soldering reliability of the two sides connecting the contacts 322, 314 will decrease.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Soldering nozzle and apparatus using the same
  • Soldering nozzle and apparatus using the same
  • Soldering nozzle and apparatus using the same

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0054] A first embodiment of the present invention will be described with reference to FIGS. 9 to 18 . 9 is a schematic diagram showing the structure of the magnetic disk device, FIG. 10 is a schematic diagram showing the combined structure of the magnetic head flaps, FIG. 11 is a schematic diagram showing the structure of the welding device, and FIGS. 12 to 16 are schematic diagrams showing the structure of the laser nozzle. 17 to 18 are schematic diagrams showing welding states.

[0055] [structure]

[0056] First, the welding device in this embodiment is used to manufacture the HGA 1 mounted on the magnetic disk device 100 as shown in FIG. 9 . Specifically, as shown in FIG. 10 , it is used to connect the magnetic head slider 2 to the flexible member 12 and the wire 13 formed on the suspension member constituting the magnetic head gimbal assembly 1 . Here, the structure of the HGA 1 will be briefly described with reference to FIG. 10 .

[0057] The magnetic head gimbal as...

no. 2 example

[0082] Next, a second embodiment of the present invention will be described with reference to FIGS. 19 to 20 . The structure of the welding device in this embodiment is basically the same as that described in Embodiment 1 above, only the shape of the nozzle 105, especially the shape of the irradiation hole is different.

[0083] Specifically, as shown in the schematic diagram viewed from the front end side of the laser nozzle 105 in Fig. 19, the output laser beam passes through a part of the periphery of the central hole 152 of the heating beam irradiation holes 152, 153' to form a nearly semicircular shape. The expansion hole 153'. As shown in FIG. 20, when the laser nozzle 105 is placed on the welding site, the expansion hole 153' is formed at a position corresponding to the contact point 22 on the slider side. Therefore, the laser beam L2 passing through the expansion hole 153' passes along the outer circumference of the solder ball 3 to function to heat the slider-side co...

no. 3 example

[0086] Hereinafter, a third embodiment of the present invention will be described with reference to FIG. 21 . The welding device in this embodiment is basically the same in structure as that described in Embodiment 1 above, only the shape of the laser nozzle 205, especially the shape of the heating beam irradiation hole is different.

[0087] As shown in the schematic view seen from the front end side of the laser nozzle 205 in Fig. 21, on the laser nozzle 205, the output laser beam passes through four positions of the central hole 252 periphery of the heating beam irradiation hole to form expansion holes 253, 254. Specifically, approximately semicircular expansion holes 253, 254 are formed on the outer periphery of the circular central hole 252, wherein a pair (symbol 254) of expansion holes is formed in the alignment direction of the solder recesses 251, and in the alignment direction A pair of (symbol 254) expansion holes are formed in the vertical direction. That is, in ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention relates to a solder tip having heating beam irradiation holes for irradiating heating beams to solder balls arranged between connection contacts formed on respective connection bodies, wherein the heating beam irradiation holes The front end of the heating beam output end is provided with a movement control part, which is used to control the movement of the solder balls at least in the direction in which the plurality of heating beam irradiation holes are arranged and in the direction perpendicular to the direction of the arrangement.

Description

technical field [0001] The present invention relates to a welding tip, in particular to a welding tip for welding by irradiating a heating beam to a solder ball. Background technique [0002] Soldering is a common method of connecting electronic components on electronic circuit boards. The soldering method can not only fix the electronic components on the electronic circuit board, but also connect the terminals formed on the electronic components with the terminals formed on the electronic circuit board through electrical connection. For example, as described below, when manufacturing a head gimbal assembly mounted on a magnetic disk device, a head slider as an electronic component may be welded to a flexible printed circuit board (flexible printed) integrally formed by a soldering method. On the suspension. Here, FIGS. 1 to 8 show a head slider welding device and a welding state. Specifically, the soldering of the so-called magnetic head slider 302 refers to connecting t...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B23K1/005B23K5/06B23K101/36B23K1/00H05K3/34
CPCB23K1/0056B23K3/0623H01L2224/742H05K3/3442H05K3/3494H05K2201/10727H05K2203/041H05K2203/107Y02P70/50
Inventor 深谷浩山口哲
Owner SAE MAGNETICS (HK) LTD