Plasma case for thin film production in enormous quantities

A plasma box and plasma technology, applied in plasma, gaseous chemical plating, metal material coating process, etc., can solve problems such as complex design, and achieve the effects of reducing equipment costs, low production and maintenance costs, and high costs

Inactive Publication Date: 2008-08-20
BEIJING XINGZHE MULTIMEDIA TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This design is quite complex, requiring substrates to be moved in and out of the reactor individually before and after each deposition process at regular intervals

Method used

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  • Plasma case for thin film production in enormous quantities
  • Plasma case for thin film production in enormous quantities
  • Plasma case for thin film production in enormous quantities

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0032] Figure 1 to Figure 7 The structure and operation of the plasma chamber 20 is shown.

[0033] Such as figure 1 As shown, a plurality of flat rectangular metal plates 77, 77A and 88 are placed in parallel with the same spacing distance. These metal plates are preferably perpendicular to the ground to facilitate flexible loading and unloading of the substrates and to reduce particulates falling on the substrates. The distance value between electrodes is in the range of 0.6-5 cm. Each electrode plate has two flat surfaces parallel to each other. That is, all electrodes 77, 77A and 88 have a uniform plate thickness. The ground electrode plates 77 all have the same size of not less than 0.6 square meters (6000 square centimeters). The outermost two ground electrodes 77A are used to form image 3 The two side walls of the plasma box 20 are shown. All the excitation electrodes 88 have the same size, which can be similar to the size of the ground electrode 77, but prefe...

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Abstract

The invention discloses a plasma enhanced chemical vapor deposition (PECVD) device and a method which are used for simultaneously coating films on a plurality of large-area base plates. A plurality of large-area base plates are arranged in rectangle plasma chambers comprising a plurality of parallel exciting electrodes and grounding electrodes at intervals and in staggered arrangement. A plurality of plasma regions are uniformly formed among all adjacent and opposite electrodes. The large-area electrode surfaces of all plasma chambers are used in a great quantity of the same, fixed and grouped film coatings of the PECVD system of a single vacuum chamber.

Description

technical field [0001] The invention discloses a vacuum coating device, in particular to a batch-processing PECVD device and method for producing low-cost and high-yield thin films on a large-area substrate. Background technique [0002] The traditional plasma-enhanced chemical vapor deposition (PECVD) system is designed such that, in a glow discharge structure in which electrical energy is capacitively coupled into a pair of parallel electrodes, each excitation electrode (power electrode, also known as an energy supply electrode, Cathode or negative electrode) provide one, and usually only one corresponding coating surface. Figure 8 Shown is such a conventional parallel electrode glow discharge (PECVD) deposition apparatus. by Figure 8 For example: in the vacuum chamber 40 of the PECVD system, there are two planar electrodes with opposite polarities, which are respectively the excitation electrode 48 and the ground electrode 47, and these two parallel electrodes keep an a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C16/513H05H1/00C23C16/52
Inventor 李沅民马昕
Owner BEIJING XINGZHE MULTIMEDIA TECH
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