Thermal isolation micro-bridge structure and processing method thereof

A technology of micro-bridge structure and thermal insulation is applied in the field of micro-bridge structure with enhanced thermal insulation and its processing, and in the field of sensors using thermal-insulation micro-bridge structure, which can solve the problems of decreased filling factor and complicated process, and improve thermal insulation performance. Effect

Active Publication Date: 2008-08-27
ZHEJIANG DALI TECH
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Problems solved by technology

[0007] In order to overcome the disadvantages of the prior art micro-bridge structure that the fill factor decreases, the effective insulation length increases and the process is complicated, the purpose of the present invention is to provide a micro-bridge structure with simple process, which not only enhances the thermal insulation performance but also does not affect the fill factor.

Method used

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  • Thermal isolation micro-bridge structure and processing method thereof
  • Thermal isolation micro-bridge structure and processing method thereof
  • Thermal isolation micro-bridge structure and processing method thereof

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Embodiment 2

[0052] Such as Figure 4 shown. In an uncooled infrared detector, a typical application example of a microbridge structure, in order to absorb radiation energy to the greatest extent, the distance between the microbridge and the substrate surface is usually required to meet a quarter of the wavelength of the incident radiation. Under this condition, the radiation reflected from the substrate surface coherently interferes with the incident radiation and facilitates the absorption of the incident radiation by the microbridges. The distance between the microbridge and the substrate surface is determined by the thickness of the sacrificial layer of the micromachining process. Typically, uncooled infrared detectors detect infrared radiation around 10 microns. The distance between the corresponding microbridge and the substrate surface is required to be about 2 microns. Therefore, the sidewall height (H) of the corrugated structure cannot exceed the thickness of the sacrificial l...

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Abstract

Disclosed are a heat insulation micro-bridge structure and the process method thereof, which belong to the technical field of a micro-electro-mechanical system. The heat insulation micro-bridge structure comprises a micro-bridge body 10, a substrate 13 and cantilever beams 11, 12, wherein the micro-bridge is suspended above the substrate 13 via the cantilever beams and forms a gap 14. As a folded structure is manufactured on the cantilever beams, the active heat insulated length of the cantilever beams is increased in the condition without influence on fill factors of the micro-bridge, thereby increasing the heat insulation effect of the micro-bridge structure. The micro-processing method of the micro-bridge includes depositing sacrificial layer materials on the surface of the substrate, producing a groove structure in the sacrificial layer, depositing and growing the sacrificial layer and forming the folded structure on the place around the groove structure on the sacrificial layer, further removing the sacrificial layer materials, thereby the micro-bridge structure which comprises the cantilever beams with the folded structure can be obtained. The micro-bridge structure can be widely used for the micro electro-mechanical system and devices such as non-refrigerated infrared detectors, gas detectors, micro-heating platforms, infrared origin devices and the like.

Description

technical field [0001] The invention belongs to the technical field of micro-electromechanical systems, and in particular relates to a heat-insulating enhanced micro-bridge structure used in a heat detector, a processing method thereof, and a sensor applying the heat-insulated micro-bridge structure. technical background [0002] In the field of micro-electromechanical systems, especially in the field of thermal sensors, the sensitive parts need to form maximum thermal insulation from the outside world. Usually the thermal insulation requirements of sensing devices are met by a design called "micro-bridge structure". That is, through the micromachining method, a thin and long cantilever beam support structure is manufactured to form a bridge-like structure suspended above the substrate. This structure is generally called a micro-bridge structure in the field of micro-electromechanical systems, especially in the field of thermal radiation detectors. Thermally insulated micr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81B3/00B81C1/00
Inventor 姜利军罗雯雯
Owner ZHEJIANG DALI TECH
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