Method for rapidly detecting micro-structure three-dimensional dimension stereoscopic picture

Abstract

The invention relates to a quick detection method for a microstructure three-dimensional stereo image, in particular to a method of establishing a matching relation through a stereo image pair and calculating the length, width and height of the microstructure through an object image inverse engineering model. The method comprises the following main steps of: preprocessing the images, picking up feature points in the images, matching the features, carrying out the optimization and error correction for matching results, carrying out the object image inverse engineering and outputting sizes of the three dimensions. The method which belongs to the non-contact type measurement without damaging the surface of a sample can ensure the measurement precision of the system. Simultaneously the method improves the detection speed through generating a stereo surface, thereby bringing about a simpler and quicker operating flow. The method is a computer-aided measuring method with high efficiency.

Description

technical field [0001] The invention relates to a method for detecting a three-dimensional stereoscopic image of a microstructure, in particular to a method for establishing a matching relationship by using a stereoscopic image pair, and calculating the length, width and height of a microstructure through an object image inverse model. Background technique [0002] Three-dimensional size detection of microstructure is an important direction in MEMS. The scale of the microstructure ranges from a few microns to tens of microns, and its volume is very small. Estimating its three-dimensional size is necessary in the processing and production of microstructures. Microstructure is a relatively large range, which can be micro-devices, such as channels, bosses, etc., or a combined system composed of multiple micro-devices. The microstructure generally needs to go through multiple processes to complete. Affected by external factors such as processing conditions, it is often necessar...

AI Technical Summary

Problems solved by technology

[0003] At present, a variety of size detection methods have appeared. Scanning electron microscopy and atomic force microscopy are two commonly used microstructure size detection methods. These two types of methods have high detection accuracy, but they are contact measurement methods. The surface is destructive

Moreover, the operation process of these two types of methods is very complicated, and it takes a long time to complete a measurement process, which is not convenient for rapid measurement in the process stage of exploration.

[0004] Interferometry, triangulation, and fringe projection methods are also used to measure the three-dimensional dimensions of microstructures. These methods are non-contact measurement methods that do not damage the surface of microstructures, but their detection resolution and accuracy are low, and they are suitable for Three-dimensional size measurement of large-scale microstructures

These methods analyze the fringe spacing and frequency information in the image, the detection accuracy is obviously affected by the external auxiliary optical system, and the operation process is relatively complicated

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