Leadless piezoelectric ceramics/polymer 1-3 structure composite material and method for processing same

A composite material and piezoelectric ceramic technology, applied in the field of lead-free piezoelectric ceramic/polymer 1-3 structure composite material and its processing, can solve the problems of high brittleness of piezoelectric ceramics and difficult mechanical micro-processing, and achieve brittleness Large, strong and tough, easy to prepare

Inactive Publication Date: 2008-09-03
TSINGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the high brittleness of piezoelectric

Method used

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  • Leadless piezoelectric ceramics/polymer 1-3 structure composite material and method for processing same
  • Leadless piezoelectric ceramics/polymer 1-3 structure composite material and method for processing same
  • Leadless piezoelectric ceramics/polymer 1-3 structure composite material and method for processing same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] According to (Li 0.04 K 0.44 Na 0.52 )(Nb 0.85 Ta 0.15 )O 3 Proportioning of raw materials, using normal pressure sintering process at 1100 degrees for 2 hours to obtain ceramic samples, the size of which is: diameter 10mm, thickness 3mm. Use 800# corundum sandpaper to smooth both sides and fix it on the sample stage of a diamond automatic scribing machine (developed by Shenyang Academy of Instrumentation, model ZSH-3), and then use a diamond blade with a thickness of 32um to cut at a rate of 1mm / s Cutting at a high speed, the cutting depth is about 0.2mm. figure 2 This is the photo of the sample obtained after parallel cutting, and the intact thin slice array sample is obtained. The width of the cut is about 40um, slightly wider than the thickness of the blade due to slight vibration and wear.

[0031] Then, epoxy resin (manufactured by Bushler, USA, mass ratio of resin / curing agent: 100:36) was coated on the surface of the incision sample, so that the resin wa...

Embodiment 2

[0033] Using the ceramic sample obtained in Example 1 and a diamond automatic scribing machine, cut under the same conditions. According to the conventional cutting method (the prior art), after the first parallel cutting, the sample is not filled with resin, and the sample is directly rotated by 90 degrees before the second parallel cutting is performed. Since the ceramic pillars are not supported by the resin, they almost completely collapse, and the ceramic pillar array structure cannot be obtained.

Embodiment 3

[0035] Using the ceramic sample obtained in Example 1 and a diamond automatic scribing machine, cut under the same conditions. Since the ceramic blades used in Example 2 were too thin and the ceramic columns were too thin, attempts were made to widen the spacing of the ceramic columns and the size of the ceramic columns. Use a diamond blade with a thickness of 50um and a ceramic column spacing of 60um. After parallel cutting, there is no resin filling, and the second parallel cutting is directly performed. Figure 6 It is a photo of the processed sample, although the processing fineness is much lower than that of Example 1, there is still the collapse of microcolumns in the sample.

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Abstract

The invention provides a leadless piezoelectric ceramics/polymer 1-3 structure composite material and processing method thereof, belonging to functional ceramic and manufacture technique field. The composite material is composed of (Na, K)NbO3 leadless piezoelectric ceramics and epoxy resin. The ceramics column is dispersed in the epoxy resin matrix and the piezoelectric ceramic micro column arrays obtained by mechanical treatment are arranged in the matrix of polymer wherein the cross sectional width of the piezoelectric ceramic micro column is 40-100 um, the aspect ratio is 3-10. The processed micro column arrays with cross sectional width of 40-100 um are arranged in the matrix of polymer. During cutting the piezoelectric ceramic, the resin is filled after first time parallelism cutting, so that the obdurability of the processed sample and integrity of micro column column is greatly enhanced, therefore the fine processing dimension of the piezoelectric ceramic micro column is increased by one order of magnitude. The 1-3 structure order composite piezoelectric material with fine structure can be used in high frequency medical ultrasound imaging technique.

Description

technical field [0001] The invention belongs to the technical field of functional ceramic materials and its manufacture, and in particular relates to a lead-free piezoelectric ceramic / polymer 1-3 structure composite material and a processing method thereof. Background technique [0002] Piezoelectric ceramic materials are widely used in the field of ultrasonic imaging, and play an important role in the fields of medical diagnosis, nondestructive testing and electroacoustics. Among them, the combination of piezoelectric ceramics and polymers is beneficial to improve the acoustic matching performance between piezoelectric ceramics and the surrounding medium, especially the piezoelectric ceramic columns or rods are oriented in the polymer matrix to form a so-called 1-3 structure. The development and application technology of composite materials (1-dimensionally connected piezoelectric phase distributed in 3-dimensionally connected polymer matrix) has always received great atten...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08J5/10C04B35/495C04B35/622B29C70/26
Inventor 李敬锋甄玉花
Owner TSINGHUA UNIV
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