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Method of reflow soldering a printed circuit board wherein an electroconductive coating material is used

A technology of printed circuit substrate and conductivity, which is applied in the direction of assembling printed circuit with electrical components, printed circuit, and printed circuit manufacturing, etc. It can solve the problem of short preheating time, uneven flux, pad patterns that cannot be applied to conductive coatings, etc. Soldering problems, achieving excellent solder joint strength and good solder leakage

Inactive Publication Date: 2008-12-10
SMK CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0012] However, although the technical idea of ​​the invention in this gazette is to prevent re-oxidation of the junction after preheating, the preheating time is short, and there is a problem of uneven activation of the flux, which cannot be applied to the use of conductive paint. The land pattern of

Method used

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  • Method of reflow soldering a printed circuit board wherein an electroconductive coating material is used
  • Method of reflow soldering a printed circuit board wherein an electroconductive coating material is used
  • Method of reflow soldering a printed circuit board wherein an electroconductive coating material is used

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Embodiment Construction

[0030] The reflow soldering method according to the present invention can be applied to various electronic substrates using conductive paint for land patterns, but in this embodiment, the case of using it as a substrate of a remote controller for remotely operating electronic equipment is used as an example. Evaluation was performed, and it demonstrates below.

[0031] As a phenolic paper substrate material in which a phenolic resin is permeated into a paper substrate, a substrate material with a thickness of 1.6 mm and an absorption rate of 2.0% (manufactured by Rishang Kogyo Co., Ltd., PS-1131) with a resist layer coated on it was prepared. (Resist manufactured by Tamura Manufacturing Co., Ltd., FINEDELDSR-330R14-13) is used as a substrate material, and a wiring pattern is screen-printed with a conductive paint.

[0032] The conductive paint used in the evaluation is a conductive paint manufactured by Maxell Hokuriku Seiki Co., Ltd. Ni powder coated with Ag is mixed with Ag ...

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Abstract

The invention provides a reflow soldering method for use with circuit patterns and land patterns formed by an electoconductive coating material. Reflow soldering is performed in an air atmosphere within a range of 150 DEG -190 DEG C. and with a preheating time set within a range of 60+-30 sec. Alternatively, preheating is performed in a nitrogen atmosphere.

Description

technical field [0001] The present invention relates to a method of soldering surface mount solder for mounting electronic components on a printed circuit board using a conductive paint. Background technique [0002] In the manufacture of printed circuit boards in which copper-clad laminates are etched to form circuit patterns, chemical etching has a large environmental load and requires special processing equipment. Therefore, research has been conducted on the use of conductive paint to form circuit patterns. technology. [0003] However, conductive paint has poor solder wettability, making it difficult to use it in the field of surface mount solder. [0004] The conductive coating disclosed in Japanese Patent Application Laid-Open No. 2006-28213 is a coating that is used as a filler to mix Ag-coated Ni powder and Ag powder. Curable resins such as phenolic resins are used as binders, and organic solvents such as butyl carbitol are used to adjust the coating. viscosity to...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/34
CPCB23K1/008B23K1/20B23K3/0646H05K1/095H05K3/3494H05K2203/086H05K2203/111H05K3/3485H05K3/34
Inventor 笠置延生桥本贤一
Owner SMK CO LTD
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