Pattern-forming material, pattern-forming apparatus and pattern-forming method

A pattern and line pattern technology, which is applied in the direction of photosensitive material processing, photosensitive materials used in photomechanical equipment, photoplate making process of patterned surface, etc., can solve the problem of low polymerization degree of monomers, low developability, and low resolution , Insufficient developer resistance, etc.

Inactive Publication Date: 2009-01-14
FUJIFILM CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in this case, the degree of polymerization of the monomers in the cured film formed by exposure becomes low, the developing solution resistance is insufficient, shrinkage of the line width occurs during development, and the developability and resolution may be lowered.
In particular, a line pattern that is isolated from adjacent line patterns at a wide interval tends to shrink significantly because it is easily affected by the developer, making it difficult to achieve high resolution.
[0006] Therefore, a pattern forming material capable of obtaining a high-resolution pattern with high sensitivity and excellent developability, a pattern forming device equipped with the pattern forming material, and a pattern forming method using the pattern forming material have not yet been provided, and further improvement is desired. to develop

Method used

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  • Pattern-forming material, pattern-forming apparatus and pattern-forming method
  • Pattern-forming material, pattern-forming apparatus and pattern-forming method
  • Pattern-forming material, pattern-forming apparatus and pattern-forming method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0467] -Manufacture of pattern forming material-

[0468] As the support body, a photosensitive resin composition solution having the following composition was applied to a polyethylene terephthalate film with a thickness of 16 μm and dried to form a photosensitive layer with a thickness of 15 μm. Pattern forming material.

[0469] [Composition of Photosensitive Resin Composition Solution]

[0470] Methacrylic acid / methyl methacrylate / styrene copolymer (copolymer composition (mass ratio): 25 / 29 / 46], mass average molecular weight: 43,000, Tg: 127°C, acid value 163mgKOH / g, I / O value: 0.55) 15 parts by mass

[0471] ・Monomer (manufactured by Toagosei Co., Ltd., M270, I / O value: 0.41) 14 parts by mass

[0472] ・B-CIM (manufactured by Hodogaya Chemical Co., Ltd.) 2.17 parts by mass

[0473] 0.23 parts by mass of 2-mercaptobenzimidazole

[0474] 0.02 parts by mass of malachite green oxalate

[0475] 0.26 parts by mass of leuco crystal violet

[0476] 40 parts by mass of methy...

Embodiment 2

[0491] In Example 1, instead of the monomer in the photosensitive resin composition (manufactured by Toagosei Co., Ltd., M270, I / O value: 0.41), UAT1 / BPE500 / M270=45 / 10 / 10 was used to make the monomer Except having made the I / O value of 0.97 and making the addition amount 7.89 mass parts, it carried out similarly to Example 1, and manufactured the pattern forming material. The mass ratio of the binder to the polymerizable compound in Example 2 was 1.9.

[0492]

[0493] Next, using the obtained pattern forming material, it carried out similarly to Example 1, measured the sensitivity and the shortest developing time (optimum developing time), and evaluated the resolution by the developing time shown in Table 1. The results are shown in Table 1.

Embodiment 3

[0495] In Example 1, except having made the developing time at the time of resolution measurement into 50 seconds, it carried out similarly to Example 1 using the same pattern forming material as Example 1, and evaluated the resolution. The results are shown in Table 1.

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Abstract

Disclosed is a pattern-forming material having high sensitivity and excellent developability, which enables to obtain a high-resolution, high-precision pattern. Also disclosed are a pattern-forming apparatus comprising such a pattern-forming material, and a pattern-forming method using such a pattern-forming material. Specifically disclosed is a pattern-forming material composed of a supporting body and at least a photosensitive layer formed on the supporting body. This pattern-forming material is characterized in that the photosensitive layer contains at least a binder, a polymerizable compound and a photopolymerization initiator, and has a sensitivity of 20 mJ/cm<2> or less. The pattern-forming material is also characterized in that the shortest developing time for developing the photosensitive layer after exposure is 15-50 seconds. Also specifically disclosed are a pattern-forming apparatus and pattern-forming method using such a pattern-forming material.

Description

technical field [0001] The present invention relates to a pattern forming material suitable for dry film resist (dry film resist) (DFR) and the like having excellent exposure sensitivity and resolution, a pattern forming device provided with the pattern forming material, and the use of the pattern A patterning method for forming a material. Background technique [0002] Conventionally, when forming a pattern such as a wiring pattern, a pattern forming material that forms a photosensitive layer by applying and drying a photosensitive resin composition on a support has been used. As a method for manufacturing the permanent pattern, for example, on a substrate such as a copper-clad laminated board on which the pattern is formed, the pattern forming material is laminated to form a laminate, and the photosensitive layer in the laminate is exposed. After exposure, the photosensitive layer is developed, and if necessary, the pattern is formed by performing etching treatment or the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/033G03F7/004G03F7/027G03F7/028G03F7/32H01L21/027H05K3/00
CPCG03F7/033G03F7/0007
Inventor 佐藤守正
Owner FUJIFILM CORP
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