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Method for processing surface of stacking slice type electronic element

A technology of surface treatment and electronic components, applied in the field of surface treatment of electronic components, can solve the problems of affecting product performance, difficult operation, easy sealing of internal electrodes, etc., achieve the effects of preventing plating diffusion, low cost, and improving welding reliability

Inactive Publication Date: 2010-12-08
SHENZHEN ZHENHUA FU ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the former is coated with glass insulating material before silver coating, there are problems such as easy sealing of internal electrodes, affecting product performance, and difficult operation; the latter is coated with insulating resin after silver coating, which requires special equipment and is difficult to operate

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0013] A surface treatment method for a laminated chip thermistor comprises the following steps:

[0014] (1) Wash the silver-coated multilayer chip thermistor in deionized water for 2 minutes, remove surface impurities and dry at 100°C for treatment; and heat the phosphoric acid solution with a concentration of 90% to 70°C in a water bath ;

[0015] (2) Soak the laminated chip thermistor to be treated in the phosphoric acid solution for 5 minutes;

[0016] (3) Air-dry the soaked multilayer chip thermistor at 25°C;

[0017] (4) Sintering the dried laminated chip thermistor at 650°C for 60 minutes;

Embodiment 2

[0019] A surface treatment method for a laminated chip thermistor comprises the following steps:

[0020] (1) Clean the laminated chip thermistor after silver coating in deionized water for 5 minutes, dry at 120°C after removing surface impurities, and wait for treatment; ) heated to 40°C in a water bath;

[0021] (2) Soak the laminated chip thermistor to be treated in the phosphoric acid solution for 0.1 minute;

[0022] (3) Dry the soaked multilayer chip thermistor at 130°C;

[0023] (4) Sintering the dried laminated chip thermistor at 900°C for 0.1 hour;

Embodiment 3

[0025] A surface treatment method for a laminated chip thermistor comprises the following steps:

[0026] (1) Wash the laminated chip thermistor coated with silver in deionized water for 1 minute, remove surface impurities and dry it at 50°C for treatment; ) heated to 90°C in a water bath;

[0027] (2) Soak the laminated chip thermistor to be treated in the phosphoric acid solution for 20 minutes;

[0028] (3) Air-dry the soaked multilayer chip thermistor at 100°C;

[0029] (4) Sintering the dried laminated chip thermistor at 300°C for 120 minutes;

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PUM

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Abstract

The invention provides a surface treatment method of a multi-layer chip electronic component, which comprises the following steps: (1) multi-layer chip electronic components which are coated with silver are cleaned in ionized water for 1-5 minutes, are dried after removing surface impurities and await to be treated, phosphoric acid solution for surface treatment is prepared, and the temperature of the solution is kept in 40-90 DGE C. (2) Electronic component wafers which await to be treated are soaked in the phosphoric acid solution for 0.1-20 minutes. (3) The wafers after being soaked are dried in 25-130 DGE C. (4) The wafers after being dried are sintered in 300-900 DGE C. Using the treatment method which is provided by the invention, the operation is simple, the cost is low, and the self-performance of products is not affected.

Description

technical field [0001] The invention belongs to a method for surface treatment of electronic components, in particular to a method for surface treatment of laminated electronic components. Background technique [0002] In the prior art, there are mainly two surface treatment methods for laminated chip electronic components. One is to apply a layer of glass insulating material on the surface of the component wafer by soaking, spraying, and printing before coating silver. The second type is coated with insulating resin on the surface of the wafer after silver coating. When the former is coated with glass insulating material before silver coating, there are problems such as easy sealing of internal electrodes, affecting product performance, and difficult operation; while the latter is coated with insulating resin after silver coating, which requires special equipment and is difficult to operate. Contents of the invention [0003] The technical problem to be solved by the emb...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01C7/04H01C7/10H01C7/02H01F41/00
Inventor 徐鹏飞高兴尧何明星丁晓鸿樊应县肖倩高永毅陈传庆潘锴
Owner SHENZHEN ZHENHUA FU ELECTRONICS