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Epoxy resin encapsulation adhesive and use thereof

A technology of epoxy resin and adhesive, which is applied in the direction of epoxy resin glue, adhesive, adhesive type, etc., and can solve problems such as large internal stress, yellow epoxy resin, and poor light transmission performance of the product

Inactive Publication Date: 2009-02-25
大连芯拓光电有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The current light-emitting diode packaging materials mainly use quaternary ammonium salts as accelerators. The epoxy resin cured by this material is easy to produce yellow color, and large internal stress is generated during the curing process, which leads to poor light transmission performance and easy aging of the product. and other shortcomings

Method used

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  • Epoxy resin encapsulation adhesive and use thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] Preparation of Component A: 14.4 grams of bisphenol A type epoxy resin.

[0026] Preparation of component B: add an appropriate amount (for example, 0.115 grams) of a composite accelerator composed of ethyl triphenylphosphorus iodide and 0.022 grams of triphenylphosphorus into 14 grams of methyl hexahydrophthalic anhydride curing agent, and then add 0.302 grams of β -(3,5-di-tert-butyl-4-hydroxyphenyl) n-octadecyl propionate antioxidant. Mix and stir in a 60°C oil bath for 30 minutes.

[0027] Mix components A and B at a mass ratio of 1:1, stir evenly, and defoam at 50°C in a vacuum oven with a vacuum degree not greater than 10 mm Hg.

[0028] Infusion method: Preheat the PTFE mold in an oven at 130°C for 1 hour, spray a small amount of release agent, pour in the encapsulation glue, then place it in an oven at 130°C, keep it warm for 50 minutes, and take it out naturally. Cool to room temperature.

Embodiment 2

[0030] Preparation of component A: 72.6 grams of bisphenol A type epoxy resin.

[0031] Preparation of component B: Add appropriate amount (eg 0.7 gram) of ethyl triphenylphosphorus iodide and 0.14 gram of triphenylphosphorus accelerator to 70 grams of methyl hexahydrophthalic anhydride curing agent, then add 1.71 grams of β-(3 , 5-di-tert-butyl-4-hydroxyphenyl) n-octadecyl propionate. Mix and stir in a 60°C oil bath for 30 minutes.

[0032] Mix components A and B at a mass ratio of 1:1, stir evenly, and defoam at 50°C in a vacuum oven with a vacuum degree not greater than 10 mm Hg.

[0033] Infusion method: Preheat the PTFE mold in an oven at 130°C for 1 hour, spray a small amount of release agent, pour in the encapsulation glue, then place it in an oven at 130°C, keep it warm for 50 minutes, and take it out naturally. Cool to room temperature.

Embodiment 3

[0035] Preparation of component A: 364.2 grams of bisphenol A type epoxy resin.

[0036] The preparation of component B: Add appropriate amount (such as 4.2 grams) ethyl triphenyl phosphorus iodide and 0.7 gram triphenyl phosphorus accelerator in 350 grams of methyl hexahydrophthalic anhydride curing agent, then add 9.3 grams of β-(3 , 5-di-tert-butyl-4-hydroxyphenyl) n-octadecyl propionate antioxidant. Mix and stir in a 60°C oil bath for 30 minutes.

[0037] Mix components A and B at a mass ratio of 1:1, stir evenly, and defoam at 50°C in a vacuum oven with a vacuum degree not greater than 10 mm Hg.

[0038] Infusion method: Preheat the PTFE mold in an oven at 130°C for 1 hour, spray a small amount of release agent, pour in the encapsulation glue, then place it in an oven at 130°C, keep it warm for 50 minutes, and take it out naturally. Cool to room temperature.

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Abstract

The invention relates to an encapsulation adhesive used for an electronic device, in particular to an epoxy resin encapsulation material for encapsulating a light emitting diode. The encapsulation adhesive has the advantages of good anti-optical weaken performance, short curing time, not getting yellow of the color of cured resin, good aging resistance, long operative time, etc. The encapsulation adhesive comprises two parts of component A and component B which are mixed to be used. The component A is A-typed bisphenol epoxy resin. The component B comprises methyl hexahydrophthalic anhydride, ethyl triphenyl iodo phosphonium, triphenylphosphine and beta-(3, 5-di-tert-butyl-4-hydroxyphenyl) propanoic acid n-octadecanol antioxidant. The mass ratio of A to B is 1 to 0.8-1.

Description

technical field [0001] The invention relates to an adhesive for encapsulating electronic components, in particular to an adhesive that can be used for encapsulating light-emitting diodes. Background technique [0002] The packaging adhesive for electronic components is made by mixing epoxy resin and curing agent in a certain proportion. In order to change its performance to meet different needs, accelerators, antioxidants, etc. are added appropriately. Selecting different substances or changing the ratio of various components will greatly affect the optical properties of the packaging material. Especially in the field of light-emitting diode packaging materials, packaging adhesives with good light transmission, low light decay rate and small internal stress are required. The current light-emitting diode packaging materials mainly use quaternary ammonium salts as accelerators. The epoxy resin cured by this material is prone to yellow color, and large internal stress is gener...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09K3/10H01L33/00H01L23/29H01L33/50
Inventor 李拓
Owner 大连芯拓光电有限公司
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