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Ball-establishing method for package substrate

A technology for packaging substrates and mounting balls, which is used in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., and can solve problems such as bridging and short-circuiting.

Inactive Publication Date: 2009-02-25
NAN YA PRINTED CIRCUIT BOARD CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, as the distance between solder balls becomes smaller and smaller, a bridging short circuit (bridge) between two adjacent solder balls often occurs on the surface of the package substrate after reflow.

Method used

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  • Ball-establishing method for package substrate
  • Ball-establishing method for package substrate
  • Ball-establishing method for package substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] Figure 1 to Figure 6 Disclosed is a schematic cross-sectional view of a first preferred embodiment of the present invention. The first preferred embodiment of the present invention adopts a non-stencil printing method, that is, abandoning the traditional printing stencil tool in the solder paste printing process, but instead adopting a high-temperature-resistant organic The dry film tool replaces the printed steel tool, and with the image transfer method, it can reduce the printing alignment abnormality caused by the difference in the hole diameter of the steel plate and the total pitch accuracy, so that it can effectively improve the yield in the solder paste printing process. System tools.

[0029] like figure 1 As shown, a packaging substrate 100 is first provided, and a plurality of solder ball pads 102 densely arranged together are formed on the first surface 100a (wafer surface), wherein the solder ball pads can be surface-treated with conductive materials, Th...

Embodiment 2

[0040] Figure 7 to Figure 13 Disclosed is a schematic cross-sectional view of a second preferred embodiment of the present invention. The second preferred embodiment of the present invention also uses an organic dry film tool to replace the printed steel tool, and cooperates with image transfer and solder ball scraping methods, which can effectively improve the process yield.

[0041] like Figure 7 As shown, a packaging substrate 100 is also provided, and a plurality of solder ball pads 102 densely arranged together are formed on the first surface 100a, wherein the solder ball pads can be surface-treated with a conductive material, and the conductive material It is generally composed of copper metal or copper alloy.

[0042] Since the present invention particularly focuses on the improvement of the ball planting process on the first surface 100a of the package substrate 100 or on the wafer surface, for the sake of simplicity of description, for the metal wires inside the p...

Embodiment 3

[0053] Figure 14 to Figure 20 Disclosed is a schematic cross-sectional view of a third preferred embodiment of the present invention. The third preferred embodiment of the present invention also uses an organic dry film tool to replace the printed steel tool, and cooperates with the image transfer method and the solder ball insertion process to effectively improve the process yield.

[0054] like Figure 14 As shown, a packaging substrate 100 is provided, and a plurality of solder ball pads 102 densely arranged together are formed on the first surface 100a, wherein the solder ball pads can be surface-treated with a conductive material, and the conductive material is generally It is composed of copper metal or copper alloy. Since the present invention particularly focuses on the improvement of the ball planting process on the first surface 100a of the package substrate 100 or on the wafer surface, for the sake of simplicity of description, the metal wires inside the package ...

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PUM

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Abstract

The invention discloses a solder sphere placing method of a package substrate. The method comprises the following steps: providing a package substrate, and arranging a plurality of concentrated solder sphere pads on a first surface; covering a solder-resistant prevention layer on the first surface, wherein the solder-resistant prevention layer is provided with a plurality of first openings corresponding to the solder sphere pad; covering a high temperature resistant manufacturing tool on the first surface; forming a plurality of second openings corresponding to the first openings; directly conducting stencil printing procedure on the surface of the tool; scrapping and extruding the solder paste into the first openings and the second openings; conducting reflow welding at the high temperature; heating and reflow-welding the package substrate and the manufacturing tool to form a projection structure; and removing the manufacturing tool.

Description

technical field [0001] The present invention relates to packaging substrate technology, in particular to an innovative method for planting balls on a semiconductor packaging substrate, which can avoid bridging short circuits between solder balls. Background technique [0002] With the continuous development of electronic products to be lighter, thinner, shorter and smaller, the market attaches more and more importance to wire bonding and flip-chip packaging technologies. Due to the multiple advantages of wire bonding and flip-chip technology over traditional packaging methods, it has become the focus of the development of the packaging and testing industry in recent years in the form of the mobile communication environment. [0003] In recent years, as ball-mounted high-end packages such as ball grid array (BGA) and flip chip (Flip Chip) have gradually become the mainstream packaging technology, the market is increasingly demanding the packaging substrate (Packaging Substrat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/48H05K3/12
Inventor 庄育杰林世宗林贤杰江国春何信芳
Owner NAN YA PRINTED CIRCUIT BOARD CORPORATION