Packaging device and manufacturing method therefor

Abstract

The invention provides a packaging device and a manufacturing method therefor. The packaging device includes a first packaging module, a second packaging module and a plurality of conducting elements. The first packaging module has a first casting mould compound layer, a first conductive column layer, a first inner connection element and a first protective layer. The first conductive column layer has opposite first and second surfaces and is embedded in the first casting mould compound layer. The first inner connection element is electrically connected to the first conductive column layer and is embedded in the first casting mould compound layer. The first protective layer is arranged on the first casting mould compound layer and the first surface of the first conductive column layer. The second packaging module has a second casting mould compound layer, a second conductive column layer and a second inner connection element. The second conductive column layer has opposite first and second surfaces and is embedded in the second casting mould compound layer. The second inner connection element is electrically connected to the second conductive column layer and is embedded in the second casting mould compound layer. The plurality of conducting elements are arranged between the second surface of the first conductive column layer and the second surface of the second conductive column layer.

Description

technical field [0001] The invention relates to a packaging device and a manufacturing method thereof, in particular to a semiconductor packaging device and a manufacturing method thereof. Background technique [0002] In the new generation of electronic products, the constant pursuit of thinner, lighter and smaller products requires multi-functional and high-performance products. Therefore, integrated circuits (Integrated Circuit, IC) must accommodate more electronic components in a limited area to achieve high density and miniaturization. To meet the requirements of globalization, the electronics industry has developed a new packaging technology for this purpose. Electronic components are embedded in the substrate, which greatly reduces the volume of the package and shortens the connection path between electronic components and the substrate. In addition, build-up technology (Build-Up) can also be used. Increase the wiring area to meet the trend of thin, light, small and m...

AI Technical Summary

Problems solved by technology

[0006] However, the above-mentioned traditional glass fiber substrate interconnection and conduction packaging structure has the following disadvantages: (1) the cost of using glass fiber material as the substrate is too expensive

(3) The glass fiber material contained in the inherent substrate will cause laser drilling (LaserVia) to be difficult to process, unable to meet the requirements of thin lines, and wiring is more troublesome, and laser drilling technology is repeatedly used to form laser blindness The stacked structure of buried holes has long processing time and complicated manufacturing process for multiple laser drilling

(4) It is also necessary to use laser drilling technology to form interconnection conduction channels on the mold compound layer, so that multiple packaging structures can be electrically connected to the package, so the cost of the overall packaging process is relatively high

The above will cause the traditional glass fiber substrate interconnection packaging structure to have no industrial advantages

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