Induction meltback technology for interconnection indium pole of infrared focal plane detector
An infrared focal plane and detector technology, applied in semiconductor devices, sustainable manufacturing/processing, electrical components, etc., can solve the problems of reducing the performance of mercury cadmium telluride devices, difficult to interconnect indium pillars with high strength, etc. Time to withstand high temperature, the effect of guaranteed performance
Active Publication Date: 2010-06-02
SHANGHAI INST OF TECHNICAL PHYSICS - CHINESE ACAD OF SCI
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Problems solved by technology
At present, there are two interconnection technologies of indium columns: cold pressure welding and reflow welding. It is difficult to obtain high-strength interconnected indium columns with cold pressure welding technology, and remelting of indium columns can greatly improve the strength of interconnections, but at present The current reflow soldering technology is carried out by heat conduction, which makes the HgCdTe material inevitably withstand a high temperature of more than 100 degrees Celsius for several minutes during the remelting process of the indium column. This high temperature process will reduce the performance of the HgCdTe device.
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[0011] The specific embodiment of the present invention is described in detail below:
[0012] 1. Interconnect the HgCdTe focal plane chip and the silicon circuit to form the focal plane component by using the flip welding machine in the cold pressure welding mode;
[0013] 2. Put the components welded by cold pressure into the middle of the induction coil of CEIA1800KHz high-frequency furnace, adjust the induction frequency to 1800KHz, and the induction power to full load;
[0014] 3. Turn on the induction heating furnace for induction heating, and turn off the induction heating furnace after 15s;
[0015] 4. Take out the heated components and continue the subsequent packaging work.
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The invention discloses an induction melt-back technique of an interconnection indium column of an infrared focal plane detector. The melting of the indium column is realized through the induced current of metal in an alternating electromagnetic field, a mercury cadmium telluride material is not heated while melting the indium column, so that the interconnection intensity can be enhanced while theperformance degradation of the mercury cadmium telluride chip at high temperature can be avoided, and the problem of melt-back of the indium column in the focal plane technique is well solved.
Description
technical field [0001] The invention relates to a photodetector manufacturing process technology, in particular to an infrared focal plane detector interconnection indium column induction remelting technology, which is suitable for the reverse soldering interconnection process of infrared focal plane devices. Background technique [0002] HgCdTe infrared focal plane detectors are used more and more widely in aerospace, military, industrial and medical fields, and play an irreplaceable key role in national defense, national security and weather forecasting. With the deepening of the application of the infrared focal plane in these fields, its reliability has become an increasingly prominent bottleneck problem, especially the thermal cycle resistance of the focal plane component is the most basic and urgent reliability requirement at present. This problem is ultimately attributed to : How to improve the thermal cycling resistance of interconnected indium pillars? Due to the t...
Claims
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IPC IPC(8): H01L31/18
CPCY02P70/50
Inventor 张海燕胡晓宁李言谨何力龚海梅张勤耀
Owner SHANGHAI INST OF TECHNICAL PHYSICS - CHINESE ACAD OF SCI