Dielectric layer lead-less glasses material for plasma display screen
A plasma and lead-free glass technology, applied in the field of glass frit, to achieve excellent chemical stability, high withstand voltage strength, and strong competitiveness
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment 1
[0046] (1) Raw material composition is by weight percentage:
[0047] Bi 2 o 3 40%
[0048] B 2 o 3 30%
[0049] BaO 15%
[0050] Al 2 o 3 3%
[0051] ZnO 5%
[0052] MgO 5%
[0053] La 2 o 3 2%
[0054] (2) Preparation method:
[0055] ① Weigh each raw material according to the weight percentage and mix them thoroughly to make a mixture;
[0056] ② Put the quartz crucible into an electric furnace with a temperature of 1300°C and preheat it for 10 minutes, in which the platinum crucible is placed inside the quartz crucible;
[0057] ③Put the mixture into a platinum crucible, melt it at a melting temperature of 1300°C, and keep it warm for 1.5 hours;
[0058] ④Crush the melted glass hydraulic sheet or pour it into cooling water;
[0059] ⑤Ball milling, sieving, packaging.
[0060] (3) Product performance:
[0061] The coefficient of expansion is 80.1×10 -7 / °C, warpage > 0.1mm, insulation resistance > 10 13 Ω, the breakdown voltage...
Embodiment 2
[0063] (1) Raw material composition is by weight percentage:
[0064] Bi 2 o 3 42%
[0065] B 2 o 3 25%
[0066] BaO 16%
[0067] Al 2 o 3 5%
[0068] ZnO 6%
[0069] MgO 3.5%
[0070] La 2 o 3 2.5%
[0071] (2) Preparation method:
[0072] The preparation method is the same as in Example 1.
[0073] (3) Product performance:
[0074] The coefficient of expansion is 84.2×10 -7 / °C, warpage > 0.1mm, insulation resistance > 10 13 Ω, the breakdown voltage is >2000V, the dielectric constant is 11-13, the glass softening point is 550°C, and the average particle size is 3.5μm.
Embodiment 3
[0076] (1) Raw material composition is by weight percentage:
[0077] Bi 2 o 3 50%, B 2 o 3 20%, BaO 15%, Al 2 o 3 3%, ZnO 5%, MgO 5%, La 2 o 3 2%.
[0078] Bi 2 o 3 50%
[0079] B 2 o 3 20%
[0080] BaO 15%
[0081] Al 2 o 3 3%
[0082] ZnO 5%
[0083] MgO 5%
[0084] La 2 o 3 2%
[0085] (2) Preparation method:
[0086] The preparation method is the same as in Example 1.
[0087] (3) Product performance:
[0088] The coefficient of expansion is 87×10 -7 / °C, warpage > 0.1mm, insulation resistance > 10 13 Ω, the breakdown voltage is >2000V, the dielectric constant is 11-13, the glass softening point is 540°C, and the average particle size is 3.4μm.
PUM
Property | Measurement | Unit |
---|---|---|
Coefficient of expansion | aaaaa | aaaaa |
Warpage | aaaaa | aaaaa |
Insulation resistance | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com