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Piezoelectric conductive epoxy resin composite damping material and preparation method thereof

A technology of composite damping material and conductive epoxy resin, which is used in epoxy resin coatings, epoxy resin glue, conductive materials dispersed in non-conductive inorganic materials, etc. problems, to achieve the effects of anti-static vibration, noise elimination, and simple preparation

Inactive Publication Date: 2009-03-25
BEIJING INSTITUTE OF TECHNOLOGYGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The invention integrates various damping and vibration reduction mechanisms, and overcomes the shortcomings of poor damping at room temperature by adding rubber, piezoelectric fillers and conductive fillers to the epoxy resin, so that the epoxy resin composite material has a wide temperature range at room temperature. It has good damping and vibration reduction performance, and the use conditions are no longer limited by the ambient temperature

Method used

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  • Piezoelectric conductive epoxy resin composite damping material and preparation method thereof
  • Piezoelectric conductive epoxy resin composite damping material and preparation method thereof
  • Piezoelectric conductive epoxy resin composite damping material and preparation method thereof

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Embodiment Construction

[0033] Below in conjunction with embodiment, further illustrate the present invention.

[0034] Performance Testing:

[0035] Test the damping performance according to "GB / T 18258-2000 Test Method for Damping Properties of Damping Materials"; test the volume resistivity according to the standard "GB / T 15662-1995 Test Method for Volume Resistivity of Conductive and Antistatic Plastics". "GB / T 2570-1995 Test method for flexural properties of resin castings" tests the flexural strength. "GB / T1043-1993 Hard Plastic Charpy Impact Test Method" tests the impact strength.

[0036] Raw material performance indicators and grades:

[0037] epoxy resin :

[0038] Type: bisphenol A glycidyl ether type epoxy resin

[0039] Grade: E-51

[0040] Source: Wuxi Diaisheng Epoxy Co., Ltd.

[0041] Molecular formula:

[0042]

[0043] Appearance: Light yellow to yellow transparent viscous liquid with low chlorine content.

[0044] Epoxy value: 0.48~0.54

[0045] Epoxy equivalent (g...

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PUM

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Abstract

The invention provides epoxy resin composite damping slurry for preparing a damping material, and a preparation method and the composite damping material thereof. The epoxy resin composite damping slurry contains components as follows: 100pbw (part by weight) of epoxy resin, 3pbw to 60pbw of rubber, 5pbw to 80pbw of piezoelectric filler and 3pbw to 30pbw of conductive filler; wherein, epoxy resin prepolymer is bisphenol A type epoxy resin; the rubber is the one which is in liquid state at normal temperature; the piezoelectric filler is piezoelectric ceramics with an average grain size of 2 Mum to 8 Mum; the conductive filler is a carbon series conductive material. The components are evenly and fully mixed according to the parts by weight and cured by adding a curing agent so as to obtain the epoxy resin composite damping material of the invention. The piezoelectric and conductive epoxy resin composite damping material of the invention has good damping effects such as eliminating noise and vibration, preventing electrostatic and the like.

Description

technical field [0001] The invention relates to an epoxy resin composite damping material, and furthermore, relates to an epoxy resin composite damping material combining the viscoelastic damping properties of polymer materials and the electric effects of piezoelectric and conductive materials and a preparation method thereof. Background technique [0002] Damping vibration and noise reduction technology is one of the ways to effectively control vibration and noise. The research and application of damping materials are becoming more and more important. Polymer materials have dual characteristics of elasticity and viscosity. When high elastic deformation occurs under the action of alternating stress (such as vibration), the movement between molecular chains has the characteristics that the deformation lags significantly behind the stress change under appropriate temperature and frequency conditions. This hysteresis deformation movement has to overcome a large resistance to do...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/02C08L83/04C08L75/04C08L9/02C08K3/24C08K7/06C08K7/24C08K9/00C09D163/02C09J163/02H01B1/24
Inventor 臧充光焦清介罗伟林日斌韩超
Owner BEIJING INSTITUTE OF TECHNOLOGYGY
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