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Synthetic resin adhesive for E1 grade fibreboard

A synthetic resin and adhesive technology, applied in adhesives, aldehyde/ketone condensation polymer adhesives, adhesive types, etc., can solve problems such as environmental pollution and damage

Active Publication Date: 2009-03-25
DAYA WOOD IND JIANGXI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the formaldehyde component released slowly by the fiberboard during use inevitably pollutes the environment and harms the human body.

Method used

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  • Synthetic resin adhesive for E1 grade fibreboard
  • Synthetic resin adhesive for E1 grade fibreboard
  • Synthetic resin adhesive for E1 grade fibreboard

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] Embodiment 1 is a kind of synthetic resin adhesive for E1 grade fiberboard according to the present invention, by following material: 37.0% formaldehyde (F), 98.0% urea (U), 99.8% melamine (M), borax, formic acid and caustic soda reaction And made.

[0033] Raw material ratio table 1, its total molar ratio is 0.99:

[0034] Table 1

[0035] Formaldehyde F 12,000KG Urea U 8,650KG Melamine M 1,050KG Borax 35KG formic acid Appropriate amount caustic soda Appropriate amount

[0036] The method of preparation is as follows:

[0037] 1) Add formaldehyde under stirring, add alkali to adjust the pH to 8.8-9.2, and raise the temperature to 40°C in 5-15 minutes;

[0038] 2) Add melamine under heat preservation at 40°C, heat up to 60°C for 20-30 minutes, measure the pH value after heat preservation for 20 minutes, and adjust the pH value to 8.5-8.7 by adding acid;

[0039] 3) Add 4150KG of urea, heat up to 90°C-93°C for 40-60m...

Embodiment 2～4

[0046] The synthetic resin adhesives for grade E1 fiberboards described in Examples 2-4 have the same raw materials and preparation methods as in Example 1, except for the ratio of raw materials and the total molar ratio. The quality index of raw material ratio and the adhesive made is as shown in table 3:

[0047]table 3

[0048]

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PUM

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Abstract

The invention discloses a synthetic resin adhesive applied to an E1-class fiber board. The synthetic resin adhesive comprises the following components calculated by mass: 1050kg to 1650kg of melamine, 8300kg to 8650kg of urea, 11500kg to 12500kg of formaldehyde, 30kg to 40kg of borax and appropriate acid and alkali. The synthetic resin adhesive is obtained by reaction carried out to the materials. The synthetic resin adhesive applied to the E1-class fiber board manufactured by the formulation has free formaldehyde lower than or equal to 0.1 percent, which meets the requirement of the E1-class synthetic resin adhesive; meanwhile, the synthetic resin adhesive has good comprehensive performance and notably increased waterproof performance. The synthetic resin adhesive, on the premise of guaranteeing the comprehensive performance of the adhesive, can lower the manufacturing cost by about RMB 100 per ton by optimizing total mole ratio and decreasing the usage of melamine, thereby having good economic efficiency.

Description

technical field [0001] The invention relates to an adhesive for wood-based panels, in particular to a synthetic resin adhesive for high-density fiberboards meeting environmental protection requirements. Background technique [0002] The conventional dry fiberboard manufacturing process uses air as the slab forming medium, and the moisture content of the formed slab is only 5-10%. Due to the lack of moisture in the slab, the pressure and temperature in the hot pressing process alone cannot form sufficient bonding force between the fibers, so a certain amount of adhesive must be added to improve the strength and water resistance of the finished product. [0003] Due to the excellent bonding performance and low cost of synthetic resin adhesives, synthetic resin adhesives are basically used in the wood industry and fiberboard manufacturing at present. Formaldehyde is contained in various synthetic resin adhesives currently used. [0004] Formaldehyde is an important organic ra...

Claims

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Application Information

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IPC IPC(8): C09J161/30B27N3/04
Inventor 程杰
Owner DAYA WOOD IND JIANGXI
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