Manufacturing and repairing method for conductive circuit of three dimensional mold interconnecting device

Abstract

The invention discloses a method for manufacturing and repairing a three-dimensional molding interconnection device conductive line. The method comprises the following steps: (1) depositing a 0.1-50 micrometer thick prearranged sizing agent layer of a conductive sizing agent on the surface of a molding structural element according to the design configuration of a conductive line; (2) baking or airing the prearranged layer of the conductive sizing agent, and removing an organic solvent thereof; (3) utilizing a laser beam to irradiate the prearranged sizing agent layer so as to enable metal conductive particles in the sizing agent to be melted and mixed with a 5-500mum thin layer of the surface of a plastic matrix, and the metal conductive particles in the sizing agent to be embedded in thesurface of the matrix, thereby obtaining a conductive pattern; and (4) conducting chemical plating of 2-10mum copper on the surface of the conductive pattern, and then conducting chemical plating of 1-3mum anticorrosion metal. By the method, various complex conductive lines can be quickly and directly manufactured or repaired on the surface of three-dimensional molding structural member of various plastic matrix. No platability is required for base materials or no special requirement is needed for the molding technical. The invention has the advantages of simple process, environment-friendliness, low cost and high flexibility.

Description

A method for manufacturing and repairing conductive lines of three-dimensional molded interconnection devices technical field The invention belongs to the technical field of manufacturing and repairing conductive circuits and the technical field of laser micromachining, and relates to a method for manufacturing and repairing conductive circuits of three-dimensional molded interconnection devices. Specifically, laser micro cladding technology is used in the manufacture and repair of interconnection circuits on the surface of three-dimensional molded interconnection devices. Background technique Three-dimensional molded interconnect device (Three-dimensionalmouldedinterconnectdevice, 3D-MID) refers to the production of wires and graphics with electrical functions on the molded plastic shell, so as to integrate the electrical interconnection function and support of ordinary circuit boards. The functions of the components and the support and protection of the plastic shell are...

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