Automatic control silicon chip check system

Abstract

The invention relates to an automatic control silicon wafer detection system which comprises an operation table provided with a mechanical hand for taking and sending a silicon wafer, a silicon wafer box platform, a silicon wafer surface detection mechanism, an object stage, a lens set and a vacuumizing device, and the automatic control silicon wafer detection system also comprises a computer system used for controlling all devices. The mechanical hand comprises a three-dimensional horizontal, vertical and rotary motion mechanism which finishes the linear movement which forms certain angle with the horizontal movement direction at certain altitude. The silicon wafer box platform comprises a crank link mechanism. A connecting bar supports a pitching swing turnover plate. A silicon wafer box is arranged on the turnover plate. The silicon wafer surface detection mechanism is provided with a vacuum chuck which can process horizontal revolution, pitching swing and autorotation. The silicon wafer is arranged on the chuck. The object stage comprises a lower layer guideway set which drives an upper layer guideway set and the object stage for coarse positioning, the upper layer guideway set drives the object stage for precise positioning, and the lens set is arranged above the object stage. The automatic control silicon wafer detection system takes, sends and observes the silicon wafer fast and conveniently, and each device can be used in a combination way and can also be used separately.

Description

technical field [0001] The invention relates to a microscopic observation system, in particular to an automatic control silicon wafer inspection system. Background technique [0002] At present, in the semiconductor manufacturing industry, silicon wafers are one of the important components. Because the silicon wafer itself is very expensive, and the requirements for the cleanliness of the silicon wafer are also very high during the process, it is necessary to take extra care when handling the silicon wafer. In addition, many processes require inspection of both sides of the silicon wafer. At present, suction cups are often used to absorb the back of the silicon wafer, and then turn it over for inspection, or place the silicon wafer under a microscope for more detailed observation. At present, there are manual and robotic operation methods for picking up and delivering silicon wafers. The robotic arm mostly adopts the form of a three-fold arm, including a multi-joint structu...

AI Technical Summary

Problems solved by technology

At present, there are manual and robotic operation methods for picking up and delivering silicon wafers. The robotic arm mostly adopts the form of a three-fold arm, including a multi-joint structure such as a main arm, an auxiliary arm, and a wrist. The mechanism is complex and bulky, and mechanical particles are easily generated during the movement. Secondary pollution to silicon wafers

In the process of turning over the silicon wafer, it is the key to make the silicon wafer turn over as flexibly as possible and prevent it from shaking at the limit position; the sucker-type related products currently used have complex structures and large volumes, and the movement is not stable. And it is easy to shake at the limit points of 0° and 90°

In the process of microscopic observation of silicon wafers, the mobile stage used for microscope observation is divided into two types: manual and automatic. The manual movement is fast, the structure is simple, and the cost is low, but the accuracy is not high and the operation is inconvenient; the automatic one uses a computer. Program control, although the precision is higher, but its structure is complicated, the processing precision is high, the cost is very expensive, and the moving speed is slow

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