Unlock instant, AI-driven research and patent intelligence for your innovation.

Electrostatic chuck apparatus

An electrostatic chuck and electrode technology, applied in the direction of positioning devices, circuits, electrical components, etc.

Inactive Publication Date: 2009-04-15
INTEVAC
View PDF0 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0034] Exemplary embodiments of the present invention relate to an electrostatic chuck for holding a substrate that solves many of the above-discussed problems and fulfills other needs not explicitly mentioned above

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Electrostatic chuck apparatus
  • Electrostatic chuck apparatus
  • Electrostatic chuck apparatus

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0061] Reference will now be made in detail to the exemplary embodiments of the present invention which are illustrated in the drawings, wherein like reference numerals refer to like elements throughout. The exemplary embodiments given below are intended to be exemplary only in all respects, with the true scope and spirit of the invention defined by the appended claims.

[0062] Such as Figure 6 As shown, an exemplary electrostatic chuck device 110 according to the present invention is disposed in a processing chamber (not shown). Such as Figure 6 As shown, the electrostatic chuck apparatus 110 includes a receiving surface 120 for receiving a substrate 130, such as a semiconductor wafer. Electrostatic chuck device 110 may be used to securely hold substrate 130 during various processing steps. The electrostatic chuck device 110 further includes a DC / RF electrode 115 disposed inside the dielectric member 117 . Also, a cooling base 125 and an optional porous sheet 127 are d...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

An electrostatic chuck includes an angled conduit, or an angled laser drilled passage, through which a heat transfer gas is provided. A segment of the angled conduit and / or the angled laser drilled passage extends along an axis different from an axis of the electric field generated to hold a substrate to the chuck, thereby minimizing plasma arcing and backside gas ionization. A first plug may be inserted into the conduit, wherein a segment of a first exterior channel thereof extends along an axis different from an axis of the electric field. A first and second plug may be inserted into a ceramic sleeve which extends through at least one of the dielectric member and the electrode. Finally, the surface of the dielectric member may comprise embossments arranged at radial distances from the center of the dielectric member so as to improve heat transfer and gas distribution.

Description

technical field [0001] Devices and methods according to the invention generally relate to an electrostatic chuck device for holding a substrate. Background technique [0002] A chuck is a device that can be used to stabilize and hold various objects such as semiconductor substrates while performing processing. There are many different types of chucks such as mechanical, vacuum or electrostatic. [0003] Electrostatic chucks stabilize and hold objects by using attractive forces between oppositely charged surfaces, such as the Coulomb force, to hold the object and the chuck together. Electrostatic chucks may be used to perform various functions, such as holding silicon wafers, in processing chambers for chemical and / or physical deposition devices as well as etching devices. [0004] Electrostatic chucks have many advantages over mechanical and vacuum chucks. For example, electrostatic chucks generally apply a more uniform force than mechanical or vacuum chucks. Electrostat...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/683C23C16/458C23C14/50B23Q3/15B25J15/00B23K26/382
CPCH01L21/6831H01L21/687
Inventor T·萨米尔T·布卢克D·格里马德
Owner INTEVAC
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com