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Multilayer wiring board and its manufacturing method

A multilayer wiring substrate, wiring substrate technology, applied in the direction of multilayer circuit manufacturing, etc., can solve the problems of electrical connectivity deterioration, inability to contact wiring materials and conductors, etc., and achieve the effect of stabilizing electrical connectivity

Inactive Publication Date: 2009-04-15
PANASONIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, there is a problem that firm contact cannot be achieved between the wiring material and the conductor, thereby deteriorating the electrical connection between the conductor and the wiring material

Method used

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  • Multilayer wiring board and its manufacturing method
  • Multilayer wiring board and its manufacturing method
  • Multilayer wiring board and its manufacturing method

Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach

[0130] FIG. 1 is a cross-sectional view showing the structure of a multilayer wiring board according to a first embodiment of the present invention.

[0131] In the multilayer wiring board, conductors 4, 9 are formed in the through-holes 3 provided in the first electrically insulating base material 1 and the second electrically insulating base material 7, and wiring between layers can be performed at any position. electrical connection, so wiring can be stored in a high density.

[0132] This multilayer wiring board has a structure in which a second electrically insulating base material 7 is pasted on both sides of a double-sided wiring board 6 as a core layer by heating and pressing, and laminated. The double-sided wiring board 6 has a structure in which first wirings 10 are formed on the front and back surfaces of the first electrically insulating base material 1 . Conductors 4 are filled in the through-holes 3 formed in the second electrically insulating base material 7 , ...

no. 2 approach

[0171] Next, referring to Figure 5A- Figure 5I The manufacturing steps of the multilayer wiring board of the present invention will be described.

[0172] In addition, a brief description will be given of the parts already described in the conventional example and the first embodiment. Furthermore, definitions of terms in the following description are also the same as those in the first embodiment.

[0173] First, as shown in FIG. 5A , protective film 2 is pasted on the front and back surfaces of electrically insulating substrate 1 .

[0174] Here, as the material of the electrically insulating base material 1, a composite base material impregnated with fibers and a resin can be used. For example, as fibers, woven or nonwoven fabrics such as glass fibers, aramid fibers, fluorine-containing fibers, and liquid crystal polymers can be used. In addition, as the impregnation resin, epoxy resin, polyimide resin, PPE resin, PPO resin, phenol resin, etc. can be used.

[0175] Amo...

no. 3 approach

[0219] Next, refer to Figure 6A 6G to illustrate other manufacturing steps of the multilayer wiring substrate of the present invention. In addition, descriptions will be briefly made for parts that overlap with the already described examples. In addition, the definitions of terms in the following description are also the same as those in the first embodiment or the second embodiment.

[0220] First, if Figure 6A As shown, conductors 17 are formed on the surface of wiring material 5 .

[0221] Here, as the wiring material 5, a metal foil can be used, and it is particularly preferable to use a roughened copper foil.

[0222] As the conductor 17 , as in the example in the first embodiment, a conductive paste formed of conductive fine particles and a thermosetting resin is used. Here, since the conductor 17 is formed in a state protruding from the wiring material 5, the screen printing method which is a simple manufacturing method is used.

[0223] Furthermore, in order to ...

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PUM

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Abstract

A multilayer wiring board comprises first and second wirings provided on both sides of an electric insulating base, a conductor extending through the electric insulating base to interconnect the first and second wirings and an anchoring conductor extending through the electric insulating base. The presence of the anchoring conductor prevents strain in the shearing direction in the electrical insulating base and deformation of the conductor. Thus, a multilayer wiring board excellent in electrical connection is provided.

Description

technical field [0001] The present invention relates to a multilayer wiring substrate electrically connecting multilayer wiring through inner via hole connection and a manufacturing method thereof. Background technique [0002] In recent years, with the miniaturization and high performance of electronic equipment, not only in industrial equipment, but also in a wide range of consumer equipment, there is a strong demand for low-cost multilayer wiring boards that can mount LSI and other semiconductor chips at high density. . In such a multilayer wiring board, it is important to electrically connect multilayer wiring patterns formed at a fine wiring pitch with high connection reliability. [0003] The interlayer connection of the existing multilayer wiring substrate is mainly realized by the metallized conductor formed on the inner wall of the through hole. The internal via hole connection method for interlayer connection at the position of the wiring pattern. The resin mult...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46
Inventor 东谷秀树
Owner PANASONIC CORP