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MCM / HIC circuit total dose irradiation testing method based on low energy X ray

A technology of total dose irradiation and test method, applied in the field of total dose irradiation test of MCM/HIC circuit based on low-energy X-rays, to achieve the effect of low dose rate and reduced test time

Inactive Publication Date: 2010-10-13
信息产业部电子第五研究所
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  • Abstract
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AI Technical Summary

Problems solved by technology

[0004]The test method used in this standard can only confirm that the entire MCM / HIC circuit reaches a certain level of radiation resistance, and cannot know the resistance of sensitive components inside the MCM / HIC circuit. radiation performance
This method is feasible for evaluating the anti-radiation ability of the circuit, but if it is necessary to evaluate the effect of the anti-radiation reinforcement design of the circuit, or to study the radiation-sensitive components in the MCM / HIC circuit, for targeted radiation To provide a basis for reinforcement and improvement, this method is a bit rough

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  • MCM / HIC circuit total dose irradiation testing method based on low energy X ray
  • MCM / HIC circuit total dose irradiation testing method based on low energy X ray
  • MCM / HIC circuit total dose irradiation testing method based on low energy X ray

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Embodiment Construction

[0014] Below in conjunction with accompanying drawing, the present invention is further elaborated:

[0015] Such as figure 1 As shown, the specific steps of the MCM / HIC circuit total dose irradiation test method are as follows:

[0016] Step 1: MCM / HIC circuit analysis. Use PSPICE software to simulate the circuit to determine the radiation-sensitive components in the MCM / HIC circuit, such as optoelectronic devices and microcircuits.

[0017] Step 2: Sampling and disposal of samples. Because of the limited penetration ability of photons, the ionizing radiation effect test is only for unpackaged devices (such as wafer level) or packaged devices with lids removed. In addition, only multi-chip devices that meet the electrical parameter specifications specified in the test plan can be submitted for radiation testing. Each device should be individually numbered so that it can be identified before and after irradiation. For ESD-sensitive devices, ESD protection technology shou...

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Abstract

The invention discloses a total dose irradiation test method for an MCM / HIC circuit based on low-energy X-ray. The method comprises the following steps: firstly analyzing the MCM / HIC circuit to determine irradiation sensitive components in the MCM / HIC circuit, then irradiating one or a plurality of sensitive components by an irradiation fixture in the operating state of the MCM / HIC circuit to determine the radiation resistance of the sensitive components in the operating state of the circuit, and finally performing total dose irradiation on the whole MCM / HIC circuit and testing electrical parameters of the MCM / HIC circuit in an on-line monitoring manner. The technology of the invention can be used for achieving anti-radiation total dose level test evaluation on a multi-chip hybrid integrated circuit, thus evaluating the radiation resistance of the whole circuit, and studying the radiation resistance of the sensitive components in the circuit, which is good for the partial anti-radiation reinforcement design of a circuit.

Description

technical field [0001] The invention relates to a low-energy X-ray based MCM / HIC circuit total dose irradiation test method, through which the X-ray total dose is irradiated to the entire MCM / HIC circuit and internal sensitive components to determine the MCM / HIC Radiation resistance of circuits and their internal sensitive components. Background technique [0002] Hybrid integrated circuit (HIC) and multi-chip module (MCM) are a kind of circuit packaging module between PC circuit board and single chip circuit. MCM / HIC can not only complete more complex functions than single chip, And the dissipated power it bears is much larger than that of a single-chip circuit. Because the MCM / HIC circuit has the characteristics of high packaging density, complex functions and good heat dissipation, it is especially suitable for application in aerospace. HIC / MCM circuits used in space and nuclear power systems may be exposed to various levels of ionizing radiation doses, so in the proce...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01R31/28G01R31/00
Inventor 罗宏伟何玉娟恩云飞师谦肖庆中
Owner 信息产业部电子第五研究所
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