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Laser processing device and laser processing method

A laser processing and laser technology, applied in laser welding equipment, metal processing equipment, optics, etc., can solve problems such as time-consuming, detachment, and film damage

Inactive Publication Date: 2010-12-15
V TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0009] Therefore, it is conceivable to prepare slit shapes corresponding to various defect shapes in advance, and irradiate laser beams based on the shape to form a light guide film. If the laser intensity is too strong, the formed film will be damaged and detached. If it is too weak, it takes the same time as the above method to form a film

Method used

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  • Laser processing device and laser processing method
  • Laser processing device and laser processing method
  • Laser processing device and laser processing method

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Embodiment Construction

[0053] Next, based on embodiment of this invention, it demonstrates concretely with reference to drawings. figure 1 (a) is a sectional view showing the structure of the laser processing apparatus of this embodiment, figure 1 (b) is a perspective view which shows the slit mask used for the said laser processing apparatus. In addition, the present invention can be implemented in, for example, a semiconductor manufacturing process and a liquid crystal manufacturing process, but in this specification, correction of wiring defects in the liquid crystal manufacturing process will be described.

[0054] like figure 1 As shown in (a), in the laser processing apparatus of this embodiment, the slit mask 20 , the relay lens 11 , the objective lens 12 , the louver 14 , and the substrate 15 to be processed are sequentially arranged along the optical path of the laser beam 8 .

[0055]like figure 1 As shown in (b), slits having a pattern shape corresponding to the shape of the correc...

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Abstract

A laser processing device and laser processing method are provided. A slit mask (20), a relay lens (11), an objective lens (12), a transom window (14) and a substrate (15) used as a processed object are sequentially arranged along an optical path of a laser (8). The slit mask (20), for example, has a linear slit (23) and a periphrastic slit (24). The laser having the shape of the slit is caused to form image (13) on the substrate (15). In addition, a raw material gas is supplied from the transom window (14) to the substrate (15). The laser CVD method is used for forming a conductive film withthe slit shape in general term so as to connect the wiring defect (broken wire part) on the substrate (15), therefore, the correction processing is performed.

Description

technical field [0001] The present invention relates to a laser processing device and a laser processing method. Background technique [0002] A processing method based on laser CVD (Chemical Vapor Deposition: Chemical Vapor Deposition) is known as a method of correcting so-called wiring defects such as disconnected portions of wiring formed on a substrate (for example, Patent Document 1). In this method, a conductive film is deposited on a disconnected part or a bypass path that bypasses the disconnected part using laser CVD to electrically connect the disconnected part of the wiring. [0003] Image 6 (a), (b) show the structure of the relevant laser processing apparatus. exist Image 6 In the laser processing apparatus shown in (a), a slit 9 , a relay lens 11 , an objective lens 12 , a gas window 14 , and a substrate 15 to be processed are sequentially arranged along the optical path of the laser beam 8 . [0004] Below, it means based on Image 6 The correction method ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C16/48H01L21/768G02F1/13B23K26/00B23K26/066B23K26/12B23K101/40H01L21/3205H01L21/336H01L23/522H01L29/786
CPCH01L21/268
Inventor 塚越雅之
Owner V TECH CO LTD