Gringding wheel

Abstract

The present invention provides a grinding wheel which can sufficiently and uniformly transmit the ultrasonic of ultrasonic transducer to a grinding tool. Even the material which is hard for grinding can be ground with an excellent efficiency. A wheel base (51) comprises the following components: an annular connecting part (511) which is connected with a wheel seat, and a grinding tool installing part (512) which is connected with the inner circumstance part of connecting part (511) and has a disc shape. Relatively to the wheel base (51), the grinding tool installing part (512) is configured that the upper surface of the grinding tool installing part (512) at the side of wheel seat does not contact the wheel seat relatively to the wheel seat. The grinding tool (52) is installed at the lower surface side of grinding tool installing part (512). The inner circumferential side of grinding tool (52) is provided with an annular ultrasonic transducer (6) which is configured at a position that forms a concentric circle with the grinding tool (52) around the center of the grinding wheel (5). The grinding tool installing part (512) comprises a plurality of arc-shaped narrow slits (513) which are positioned at the interface between the connecting part (511) and the grinding tool installing part (512) and are formed along the circumferential direction.

Description

technical field [0001] The invention relates to a grinding wheel. The grinding wheel has: a wheel base, which is installed on a wheel seat, and the wheel seat is arranged at one end of a rotating main shaft, and the rotating main shaft is configured to grind a workpiece held on a chuck table. grinding member for cutting; and an annular grinding tool mounted on the above-mentioned wheel base. Background technique [0002] In the semiconductor device manufacturing process, on the surface of a semiconductor wafer having a substantially disc shape, a plurality of regions are divided by planned dividing lines called streets arranged in a grid pattern, and ICs (Integrated Circuits) are formed on the divided regions. Circuit: integrated circuit), LSI (large scale integration: large scale integrated circuit) and other devices. Then, by cutting the semiconductor wafer along the lanes, the region in which the device is formed is divided to manufacture individual semiconductor chips. ...

AI Technical Summary

Problems solved by technology

[0006] However, although the grinding device of Patent Document 1 discloses a specific example in which an ultrasonic application member is arranged on the chuck table to apply ultrasonic vibrations to the chuck table, it does not describe the ultrasonic wave for generating the ultrasonic vibrator. There is a problem that ultrasonic vibration cannot be sufficiently and uniformly transmitted to the specific structure of the target grinding tool, and difficult-to-grind materials cannot be smoothly ground.

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