Seed gas bubble micro heat exchanger and seed gas bubble micro heat exchanger system

Abstract

The invention discloses a seed gas bubble micro heat exchanger system. The system comprises an IC chip to be cooled, a heat exchanger body for cooling the IC chip, a control circuit, a liquid supply circuit which is used for supplying liquid to a micro heat exchanger and is communicated to two ends of the heat exchanger body, an impulse voltage generator which is electrically connected with the heat exchanger body and used for supplying an exciting voltage signal to the heat exchanger body, and a final cold trap radiator which is connected with the liquid supply circuit and is used for releasing heat absorbed by the liquid supply circuit to the atmospheric environment, and the control circuit is electrically connected with the impulse voltage generator. The seed gas bubble micro heat exchanger system can trigger phase change heat transfer in micro-channels as quickly as possible, which thoroughly solves a difficult problem that high boiling starting point temperature, ensures that a micro heat transfer system is not over heated when being started, avoids burning down the chip to be cooled and greatly prolongs the service life of the chip to be cooled.

Description

technical field [0001] The invention relates to the technical field of heat exchangers, in particular to a seed bubble micro heat exchanger and a seed bubble micro heat exchanger system. Background technique [0002] With the development of science and technology today, great progress has been made in high-tech fields such as semiconductors, information, biochips, and space technology. The common trend of its development is the miniaturization and multi-function of equipment. Silicon is the main base material of semiconductor and information technology, and has been widely used. In recent years, due to the development of microsystem technology, people have begun to use etching methods to manufacture micromachines with silicon as the base material. Micro-scale heat exchangers, micro-heat pipes, etc. are such technologies. [0003] Silicon micro heat exchangers have the following characteristics: (1) Compatible with other semiconductor devices; (2) Silicon is a good thermal...

AI Technical Summary

Problems solved by technology

According to conventional methods, people mostly use methods such as increasing the channel surface roughness and preparing artificial nucleation holes to enhance heat transfer, but they cannot fundamentally solve the above problems and overcome the shortage of boiling heat transfer.

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