Polishing liquid feeding pipe and chemical mechanical polishing device

Abstract

The invention relates to a pipeline for feeding a lapping liquid, which comprises a lapping liquid container, a first pipeline for inputting the lapping liquid to the lapping liquid container, a second pipeline for outputting the lapping liquid in the lapping liquid container, and a transverse pipe positioned under the liquid level in the lapping liquid container and communicated with the first pipeline, wherein the transverse pipe comprises an S-shaped pipe body which is communicated with the first pipeline and is provided with a bended part, and outlet parts positioned at two ends of the pipe body; and the included angle between the radial cross section of the transverse pipe and the radial cross section of the lapping liquid container is more than 0 degree but less than or equal to 90 degrees. The invention also provides a chemico-mechanical grinding device. The pipeline for feeding the lapping liquid can reduce or overcome the defects that the lapping liquid generates sedimentation, crystallization, and the like in the feeding pipeline.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a grinding liquid supply pipeline and a chemical mechanical grinding device. Background technique [0002] With the continuous improvement of semiconductor integrated circuit manufacturing technology, the line width continues to decrease, and the number of interconnection layers is also increasing. The deposition process of multi-layer interconnection or filling with a large aspect ratio will cause excessive fluctuations on the surface of the semiconductor wafer, causing Focusing is difficult in the lithography process, which weakens the ability to control the line width in the lithography process and reduces the consistency of the line width on the entire semiconductor wafer. The industry introduces Chemical Mechanical Planarization (CMP) to planarize the surface of the semiconductor wafer. [0003] In the chemical mechanical polishing process, the semicondu...

AI Technical Summary

Problems solved by technology

[0007] Yet, owing to have grinding particulate matter in the grinding liquid, the grinding liquid in the grinding liquid container 58 often can produce defects such as precipitation, crystallization.

After the precipitates and crystals are transported to the grinding device 60, they will cause defects on the surface of the ground semiconductor structure, resulting in a decrease in the yield of the formed semiconductor device.

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