Polishing liquid feeding pipe and chemical mechanical polishing device

A technology of grinding fluid and supply tube, applied in grinding/polishing equipment, metal processing equipment, manufacturing tools, etc., can solve the problems of semiconductor device yield decline, precipitation, crystallization, etc.

Inactive Publication Date: 2009-06-17
SEMICON MFG INT (SHANGHAI) CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] Yet, owing to have grinding particulate matter in the grinding liquid, the grinding liquid in the grinding liquid container 58 often can produce defects such as precipitation, crystallization.
After the preci

Method used

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  • Polishing liquid feeding pipe and chemical mechanical polishing device
  • Polishing liquid feeding pipe and chemical mechanical polishing device
  • Polishing liquid feeding pipe and chemical mechanical polishing device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0053] image 3 It is a perspective view of the first embodiment of the grinding liquid supply pipeline of the present invention. Please refer to image 3 The grinding liquid supply device includes a grinding liquid container 202 for holding the grinding liquid, a first pipeline 204 for inputting the grinding liquid to the grinding liquid container 202, a water tank that communicates with the first pipeline 204 and is positioned under the liquid surface of the grinding liquid container 202. The horizontal pipe 208 and the second pipeline 206 for outputting the grinding liquid from the grinding liquid container 202 to the outside.

[0054] Wherein, one end of the second pipeline 206 is connected with the grinding liquid container 202 . The other end of the second pipeline 206 may be connected to a grinding device (not shown), and a transport pump 207 may also be provided on the second pipeline 206 .

[0055] One end of the first pipeline 204 can be connected to the grinding ...

Embodiment 2

[0069] Figure 5 It is a perspective view of the second embodiment of the grinding liquid supply pipeline of the present invention.

[0070] Please refer to Figure 5 The grinding liquid supply device includes a grinding liquid container 202 for holding the grinding liquid, a first pipeline 204 for inputting the grinding liquid to the grinding liquid container 202, a water tank that communicates with the first pipeline 204 and is positioned under the liquid surface of the grinding liquid container 202. The horizontal pipe 208 and the second pipeline 206.

[0071] Wherein, one end of the second pipeline 206 is connected with the grinding liquid container 202 . The other end of the second pipeline 206 may be connected to a grinding device (not shown), and a transport pump 207 may also be provided on the second pipeline 206 .

[0072] One end of the first pipeline 204 can be connected to the grinding liquid supply source (not shown), and the other end can communicate with the ...

Embodiment 3

[0087] The end of the first pipeline extending below the liquid level of the grinding fluid in the grinding fluid container can be connected with two horizontal tubes, and the two horizontal tubes intersect, and at the intersection with the first pipeline connected. , the others are the same as those in the first embodiment, and will not be repeated here.

[0088] The end of the first pipeline of the supply pipeline in the second embodiment extending to below the liquid level of the grinding liquid in the grinding liquid container may also have two horizontal tubes, and the two horizontal tubes intersect. The intersection part communicates with the first pipeline. I won't go into details here.

[0089]In other embodiments, there may be three or more horizontal tubes, which will not be repeated here.

[0090] The invention also provides a chemical mechanical polishing device.

[0091] Figure 7 is a perspective view of an embodiment of the chemical mechanical polishing app...

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Abstract

The invention relates to a pipeline for feeding a lapping liquid, which comprises a lapping liquid container, a first pipeline for inputting the lapping liquid to the lapping liquid container, a second pipeline for outputting the lapping liquid in the lapping liquid container, and a transverse pipe positioned under the liquid level in the lapping liquid container and communicated with the first pipeline, wherein the transverse pipe comprises an S-shaped pipe body which is communicated with the first pipeline and is provided with a bended part, and outlet parts positioned at two ends of the pipe body; and the included angle between the radial cross section of the transverse pipe and the radial cross section of the lapping liquid container is more than 0 degree but less than or equal to 90 degrees. The invention also provides a chemico-mechanical grinding device. The pipeline for feeding the lapping liquid can reduce or overcome the defects that the lapping liquid generates sedimentation, crystallization, and the like in the feeding pipeline.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a grinding liquid supply pipeline and a chemical mechanical grinding device. Background technique [0002] With the continuous improvement of semiconductor integrated circuit manufacturing technology, the line width continues to decrease, and the number of interconnection layers is also increasing. The deposition process of multi-layer interconnection or filling with a large aspect ratio will cause excessive fluctuations on the surface of the semiconductor wafer, causing Focusing is difficult in the lithography process, which weakens the ability to control the line width in the lithography process and reduces the consistency of the line width on the entire semiconductor wafer. The industry introduces Chemical Mechanical Planarization (CMP) to planarize the surface of the semiconductor wafer. [0003] In the chemical mechanical polishing process, the semicondu...

Claims

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Application Information

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IPC IPC(8): B24B57/02
Inventor 闫大鹏
Owner SEMICON MFG INT (SHANGHAI) CORP
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