Method for preparing zinc nitride film

A thin film preparation, zinc nitride technology, applied in the direction of ion implantation plating, metal material coating process, coating, etc., can solve the problem that there is no report on the stability of zinc nitride, no in-depth research on the photoelectric characteristics of the film, and poor film stability And other problems, to achieve the effect of good stability, high transmittance, low film resistivity

Inactive Publication Date: 2009-06-24
闫金承
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  • Abstract
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  • Application Information

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Problems solved by technology

In China, it was found that Zong et al. [2] Zinc nitride film was prepared by sputtering zinc nitride target, but the stability of the film is poor, and there is no in-depth study on the photoelectric properties of the film
From the perspective of domestic and foreign materials, further research is needed on the forbidden band type and conductivity type of zinc nitride, and there is no report on the stability of zinc nitride.

Method used

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Embodiment Construction

[0008] The present invention is further described below:

[0009] A zinc nitride thin film preparation method is characterized in that a mixed gas of nitrogen and argon is introduced into a sputtering combined device while zinc is being sputtered, and relatively stable zinc nitride is prepared on a quartz substrate, and the steps are as follows:

[0010] 1. First, use alcohol, acetone, and deionized water to clean the quartz substrate in ultrasonic waves, put the zinc target in the magnetron sputtering chamber, and put the substrate into the sputtering chamber.

[0011] 2. First use the mechanical pump to evacuate, then replace the molecular pump to evacuate to a high vacuum, generally until the background vacuum is 10 -4 --10 -5 Pa,

[0012] 3. Turn on the flow meter, first pump the air in the air path, and start filling nitrogen when the flow rate drops to zero, the flow rate is 60-80sccm, and the gas should be continuously pumped during this process.

[0013] 4. Heat up ...

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Abstract

The invention relates to a method for preparing a zinc nitride film, which is characterized in that the mixed gas of nitrogen and argon is pumped into a sputtering combination plant when sputtering zinc, and stabler zinc nitride is prepared on a quartz substrate. The method comprises the steps: first, the quartz substrate is cleaned by alcohol, acetone and deionized water in ultrasonic wave, a zinc target is put into a magnetron sputtering chamber, and the quartz substrate is also placed in the sputtering chamber; the sputtering chamber is vacuumized below the high vacuum until the background vacuum is 10<-4>-10<-5>Pa; a flowmeter is turned on, the air in the gas circuit is firstly pumped, and nitrogen is started to be filled when the flow rate is reduced to be zero; when the flow rate is 60-80sccm, the gas is continuously pumped in the process; when being heated to 200 DEG C, the pressure intensity of the sputtering chamber is slightly increased, and then build-up of luminance is carried out; the reaction starts after half hour of pre-sputtering, and the reaction lasts for about two hours; when the reaction stops and the temperature of the sputtering chamber reduces to about 50 DEG C, the machine can be stopped, and the substrate is taken out. The film obtained by the method has low electric resistivity, high migration rate and transmittance, good stability, etc.

Description

Technical field: [0001] The invention relates to a production method of a material, in particular to a preparation method of a zinc nitride thin film. Background technique: [0002] Through the research on the preparation method of zinc nitride thin film, it is found that zinc nitride is a wide bandgap semiconductor material, which is less studied in the world. Futsuhara et al. [1] In 1998, Zn was prepared on glass substrate by reactive sputtering method. 3 N 2 , to study the photoelectric properties of the film. In China, it was found that Zong et al. [2] Zinc nitride thin films are prepared by sputtering with zinc nitride targets, but the stability of the thin films is poor, and there is no in-depth study on the photoelectric properties of the thin films. From the perspective of materials at home and abroad, further research is needed on the forbidden band type and conductivity type of zinc nitride, and there is no report on the stability of zinc nitride. Invention c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/35
Inventor 闫金承焦芳冉秦云海孟超
Owner 闫金承
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