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Heat dissipating wiring board and method for manufacturing same

A manufacturing method and technology for wiring boards, which are applied in the manufacture of printed circuits, removal of conductive materials by discharge methods, and removal of conductive materials by chemical/electrolytic methods, etc., can solve problems such as narrowing and poor fluidity.

Inactive Publication Date: 2009-06-24
PANASONIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, the flow path of the filler-containing resin narrows sharply from the surface of the metal wiring board 115 to the inside of the through groove 114, resulting in poor fluidity.

Method used

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  • Heat dissipating wiring board and method for manufacturing same
  • Heat dissipating wiring board and method for manufacturing same
  • Heat dissipating wiring board and method for manufacturing same

Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach

[0072] In the first embodiment, a case where heat generating components are adjacently mounted at a high density will be described. Here, as heat-generating components, there are electronic components such as power semiconductors (power transistors, power FETs, CPUs, etc.), microtransformers, and LEDs. The miniaturization of such electronic components contributes to the miniaturization of equipment. However, as such electronic components are miniaturized, or the mounting method (for example, packaging method) of electronic components becomes smaller (and further, during bare chip mounting, etc.), heat generation (or heat dissipation) becomes a more important issue. Therefore, in the first embodiment, an LED is selected as an example of a heat-generating component and described in detail.

[0073] In the first embodiment, a heat radiation wiring board 10 for a large current of 100 A (ampere) as an LED mounting substrate will be described as an example.

[0074] figure 1 An ...

no. 2 approach

[0165] Second, use Figure 5 , and the second embodiment will be described. In addition, the same reference numerals are assigned to the same parts as those in the drawings used in the description of the first embodiment.

[0166] The second embodiment corresponds to, for example, the case where the expanded groove 21 is formed by etching or machining, and then the fine groove 20 is formed by laser.

[0167] Figure 5 It is a schematic cross-sectional view showing the state after the oxide film 24 is formed on the surface of the fine groove 20 . Here, as an insulating film, by forming an oxide film 24 on the surface of the fine groove 20, the insulating effect of the combined use of an insulating film can be enhanced. As the oxide film 24, a metal oxide film formed by oxidizing the surface of the metal wiring board 15 can be used.

[0168] exist Figure 5 Among them, a part of the through groove 14 consists of a fine groove 20 having an opening 20a on the upper surface of...

no. 3 approach

[0180] Second, use Figure 6 to Figure 9 , and the third embodiment will be described.

[0181] Figure 6 It is a schematic sectional view explaining the case where the through groove 14 is formed by performing groove processing from both sides of the metal wiring board 15 . In addition, the same reference numerals are attached to the same parts as those in the drawings used in the description of the first embodiment and the second embodiment.

[0182] First, a copper or aluminum plate or a laminate or composite plate of these materials is prepared. In addition, it is also possible to use a sheet material in which necessary parts are pressed by pressurization. And, let this be the metal wiring board 15 .

[0183] Secondly, if Figure 6 As shown, from the back side of the metal wiring board 15, the expanded groove 21 is formed by etching or laser processing as indicated by an arrow 25a. Next, from the surface side of the metal wiring board 15, as shown by the arrow 25b, t...

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PUM

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Abstract

A heat dissipating wiring board comprises: a metal wiring plate with a circuit pattern formed therein: a filler containing resin layer embedded with the metal wiring plate such that a top surface of the metal wiring plate is exposed; and a heat dissipating plate arranged on an under surface of the filler containing resin layer, wherein the circuit pattern is formed of a through groove provided in the metal wiring plate, and this through groove is made up of: a fine groove that opens at the top surface of the metal wiring plate; and an expanded groove that expands from a lower end of the fine groove toward the under surface of the metal wiring plate. The heat dissipating wiring board is capable of improving reliability against electric insulation due to a dust or the like in a space of the through groove.

Description

technical field [0001] The present invention relates to a heat dissipation wiring board including a metal wiring board, a heat conductive resin layer, and a heat dissipation plate on which heat generating elements such as LED elements are mounted, and a method for manufacturing the same. Background technique [0002] Figure 20A is a perspective view of a conventional heat dissipation wiring board, Figure 20B is its cross-section. [0003] Such as Figure 20A with Figure 20B As shown, a conventional heat dissipation wiring board 101 includes a metal wiring board 103 , a filler-containing resin layer 104 , and a heat dissipation plate 105 . The metal wiring board 103 forms a circuit pattern and has a through groove 102 . The metal wiring board 103 is embedded in the filler-containing resin layer 104 so that the upper surface of the metal wiring board 103 is exposed. The heat sink 105 is disposed on the lower surface of the filler-containing resin layer 104 . The throug...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/36H01L23/12H05K1/02H05K3/06H05K3/08
CPCH05K2201/09881H01L23/3737H01L23/49861H05K2201/10106H05K2201/0376H05K2201/09118H05K2201/098H05K3/202H01L2924/0002H05K3/06H05K2203/0369H05K2201/0209H05K3/027H05K1/056H05K1/0373H05K2203/1476H01L24/81H01L2924/12042H01L2924/15747H01L2924/00
Inventor 津村哲也西山公治辻本悦夫
Owner PANASONIC CORP
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