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Dual-spindle surface shearing stress sensor

A technology of shear stress and sensors, which is applied in semiconductor/solid-state device components, fluid pressure measurement using capacitance changes, piezoelectric/electrostrictive/magnetostrictive devices, etc., can solve the problem that the surface shear stress cannot be realized at the same time Size measurement and determination of fluid direction, etc., to achieve the effect of miniaturization and improvement of resolution

Inactive Publication Date: 2009-07-15
NANJING UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When applied to a fluid whose direction is unknown or whose direction will change, the sensor structure has great limitations and cannot simultaneously measure the magnitude of the surface shear stress and determine the direction of the fluid

Method used

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  • Dual-spindle surface shearing stress sensor
  • Dual-spindle surface shearing stress sensor
  • Dual-spindle surface shearing stress sensor

Examples

Experimental program
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Effect test

Embodiment Construction

[0015] combine figure 2 , the biaxial surface shear stress sensor of the present invention includes fixed bases 1a, 1b, 1c, 1d, external fixed comb electrodes 2a, 2b, external support beams 3a, 3b, 3c, 3d, floating unit 7, external fixed combs Teeth 8a, 8b and external sensitive combs 9a, 9b, the external fixed combs 8a, 8b and external sensitive combs 9a, 9b form sensitive capacitors 200, 201 respectively, and the two sensitive capacitors 200, 201 form a Differential capacitor structure, the external fixed comb teeth 8a, 8b are respectively connected with the external fixed comb teeth electrodes 2a, 2b, and consist of upper and lower layers, the upper layer is the surface shear stress sensor mechanical structure made on the single crystal silicon wafer, the lower layer For making the signal leads on the glass substrate, the fixed base 1a, 1b, 1c, 1d, the external fixed comb electrodes 2a, 2b, the external fixed comb teeth 8a, 8b, the external sensitive comb teeth 9a, 9b, the...

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PUM

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Abstract

The invention discloses a double shaft surface shear stress sensor, belonging to the micro electromechanical system technology field, which consists of an upper and a lower layer; the upper layer is a surface shear stress mechanical structure manufactured on a monocrystalline silicon chip; and the lower layer comprises signal leading wires manufactured on a glass substrate. the upper layer mechanical structure of the surface shear stress sensor comprises a fixed pedestal, an outside fixed comb electrode, an outside sensitive comb, an outside support beam, a bracing frame, an inside support beam, an inside fixed comb electrode, an inside fixed comb, an inside sensitive comb and a floating unit; the inside fixed comb and the inside sensitive comb are used for measuring the surface shear stress in horizontal direction; and the outside fixed comb and the outside sensitive comb are used for measuring the surface shear stress in vertical direction. Applying the invention can determine the direction of the surface shear stress in a plane, and measure the magnitude of surface shear stress.

Description

technical field [0001] The invention belongs to the technical field of micro-electromechanical systems (MEMS), in particular to a biaxial surface shear stress sensor. Background technique [0002] The measurement of surface shear stress is of great significance in basic scientific research, industrial control and biomedical applications. For example, under hypersonic conditions, accurately obtaining information on the magnitude of the frictional stress on the surface of the aircraft and the transition of the boundary layer will provide a reliable basis for the correct thermal protection design. [0003] Traditional macro-scale measurement techniques cannot meet the requirements of obtaining accurate surface shear stress data. The advantages of miniaturization of MEMS technology make the shear stress sensor based on MEMS technology have a sufficiently high spatial resolution, which has the potential to significantly improve the time and space measurement bandwidth, and meet ...

Claims

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Application Information

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IPC IPC(8): G01L9/12B81B7/02
Inventor 黄钦文苏岩裘安萍明晓
Owner NANJING UNIV OF SCI & TECH
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