Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Hot-melt adhesive for fixing IC module, and laminated tape and IC card using the adhesive

A hot-melt adhesive and adhesive technology, applied in the directions of adhesives, record carriers used in machines, adhesive types, etc., can solve the problems of difficulty in detecting IC chips, reduced workability, low transparency, etc., and achieve excellent visible light transmittance and Effects of bond strength, easy detection, excellent solvent resistance

Active Publication Date: 2012-12-19
TOAGOSEI CO LTD
View PDF1 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, in this step, it is inspected whether the IC chip is arranged on each circuit pattern, but at this time, when the transparency of the adhesive tape is low, there is a problem that it becomes difficult to detect the IC chip.
In addition, since the cutting is performed continuously, the temperature of the punching blade and the like rises, and depending on the composition, the adhesive may melt and adhere to the punching blade, etc., and workability may decrease.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Hot-melt adhesive for fixing IC module, and laminated tape and IC card using the adhesive
  • Hot-melt adhesive for fixing IC module, and laminated tape and IC card using the adhesive
  • Hot-melt adhesive for fixing IC module, and laminated tape and IC card using the adhesive

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～8 and comparative example 1～3

[0099] Use the saturated polyester resin described in Table 1, as well as epoxy resin, inorganic filler, and hydrolytic agent according to the ratio described in Table 2 and Table 3, and use a twin-screw type mixer to manufacture hot melt for fixing IC modules adhesive.

[0100] As the epoxy resin, the inorganic filler, and the hydrolysis agent, the following substances were used, respectively.

[0101] Epoxy resin: Bisphenol A type, manufactured by Japan Epoxy Co., Ltd., trade name "EP-1007"

[0102] Inorganic filler: Talc, manufactured by Fuji Fine Co., Ltd., trade name "RKP-80"

[0103] Waterproofing agent: polycarbodiimide, manufactured by Sumitomo Bayer Polyurethane Co., Ltd., trade name "NPE"

[0104] The performance of each hot melt adhesive for fixing IC modules was evaluated as described below.

[0105] (1) Visible light transmittance

[0106] The transmittance at a wavelength of 600 nm was measured using a spectrophotometer.

[0107] Measuring device: Spectrophotometer (manufact...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
enthalpy of fusionaaaaaaaaaa
softening pointaaaaaaaaaa
transmittivityaaaaaaaaaa
Login to View More

Abstract

An objective of the present invention is to provide a hot-melt adhesive for fixing an IC module, which has sufficient transparency and excellent solvent resistance, and to provide a laminated tape and an IC card formed using the adhesive. The hot-melt adhesive for fixing an IC module comprises a saturated polyester resin having a heat of fusion of 8-25 mJ / mg and a transmittance of 5% or higher when a film of the adhesive having a thickness of 30 µm is subjected to measurement by a visible light at a wavelength of 600 nm. The laminated tape (T) of the present invention is provided with an IC module tape (121) having an IC module substrate tape (121a), an IC chip (12b) arranged on one surface of the tape and a sealing part (12c), and an adhesive tape (131), which is formed using the present hot-melt adhesive for fixing an IC module and is bonded to one surface of the IC module substrate tape (121a) and the sealing part (12c). Furthermore, the IC card of the present invention is provided with a card body, an IC module and an adhesive layer bonding the card body and the IC module.

Description

Technical field [0001] The present invention relates to a hot-melt adhesive for fixing an IC module, a laminated tape and an IC card using the adhesive. In more detail, the present invention relates to a hot-melt adhesive for fixing IC modules that has sufficient transparency and excellent solvent resistance, moisture and heat resistance, and heat resistance. The adhesive tape using the adhesive and the IC module tape The laminated laminated tape and the IC card formed by joining and fixing the IC module cut out from the laminated tape to the card body. Background technique [0002] In recent years, IC cards that can record more data than magnetic cards and can also encrypt data so that they are difficult to forge are becoming popular. In this type of IC card, an IC module is inserted into a recess of a resin card body, and the periphery of the IC card is joined and fixed to the card body with a hot melt adhesive. This type of IC card is sometimes subjected to deformation such ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C09J167/02C09J7/02C09J163/02G06K19/077
CPCH01L2924/01082C09J167/02H01L2924/01004H01L21/56H01L2924/01049H01L2924/01045H01L2924/12041H01L23/49855H01L2924/01019H01L2924/01027H01L2224/83C09J2201/61C08L63/00H01L2924/01013G06K19/07747H01L24/97H01L2924/0103G06K19/07718H01L2924/14H01L24/83H01L2924/01005H01L2924/01033G06K19/07745H01L2924/01006H01L2924/0102H01L2924/01074H01L2924/01012H05K3/305H01L21/58C08L2666/22C09J2301/304
Inventor 今堀诚
Owner TOAGOSEI CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com