Method for dissembling and processing waste and old circuit board for reuse of component

A technology for waste circuit boards and processing methods, applied in the fields of production, maintenance and waste recycling, can solve the problems of damage to chip reliability, plastic-packaged IC chip reliability damage, plastic-packaged IC chip delamination, etc., to avoid appearance size and The destruction of performance, the effect of ensuring reusability

Inactive Publication Date: 2009-08-12
TSINGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

There is a common disadvantage in high-temperature dismantling: high temperature may cause moisture to damage the reliability of components, especially plastic-encapsulated IC chips
When directly dismantling waste circuit boards at high temperature (the temperature is higher than the melting point of solder, up to 200°C or higher), it is easy to cause delamination of the plastic IC chip on it, which seriously damages the reliability of the chip

Method used

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  • Method for dissembling and processing waste and old circuit board for reuse of component

Examples

Experimental program
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Embodiment

[0044] Example: Disassembly process of a circuit board with components on one side

[0045]1) Take a piece of waste computer motherboard, on which there are a large number of aluminum electrolytic capacitors distributed, it is judged that it should be baked at low temperature, put it into a blast drying oven, put a desiccant in the drying oven, and set the temperature in the drying oven to 80 ℃, bake for 6 days, take out;

[0046] 2) Remove the components connected by non-welding methods such as buckle connection and thread connection on the circuit board, and guide the pins of the plug-in components to be removed on the circuit board as straight as possible so that they are basically perpendicular to the circuit board substrate, and use clamps Fixed circuit board;

[0047] 3) The circuit board is heated by infrared radiation and heat convection. The circuit board is gradually heated from room temperature to 150-160°C within 1.5-2 minutes and kept warm for 60s. Then, the circ...

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Abstract

The invention provides a waste circuit board disassembling processing method for recycling components and pertains to the field of components recycling. The invention is characterized in that: according to the type of circuit board baseplate and the model of components, circuit boards of non-thermostable components without high electrolytic capacitance are respectively baked below 200 degrees so as to eliminate components connected in a non-welded way and straighten the pins of plug-in components to be eliminated; then according to the melting point of solders used by the circuit board, the heating temperature curve is designed under the set heating way and heating rate so as to fully melt the solders and separate the components from the circuit board under the external force. Meanwhile, integrated circuit chips to be recycled is subjected to appearance check, residual solder elimination, repair of pins or welding discs, appearance cleaning and baking and finally electric performance test. The invention effectively avoids the damages of disassembly at high temperature to the appearance, dimension and performance of components and ensures the reusability of components through appearance repair and performance test.

Description

technical field [0001] The invention relates to a non-destructive disassembly of components from waste printed circuit boards based on functional recovery, and a treatment process for performance testing of components, which belongs to the technical field of production, maintenance and recycling of waste products. Background technique [0002] Printed Circuit Board (PCB for short, or Printed Wiring Board, PWB for short) is an important part of electronic information products, household electrical appliances, etc. A printed circuit board is usually a component that is soldered by low-temperature soldering to an insulating substrate printed with electrically connected conductive patterns and several components. The substrates are mostly flame-retardant phenolic paper-based copper-clad laminates, non-flame-retardant phenolic paper-based copper-clad laminates, or epoxy glass fiber cloth-based core boards. Various types, including various integrated circuits (ICs), diodes, triod...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K1/018B09B3/00
CPCY02W30/82
Inventor 向东牟鹏汪劲松段广洪杨继平丁晓宇龙旦风
Owner TSINGHUA UNIV
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