Picosecond laser machining apparatus for processing nozzle micropore

A micro-hole processing and picosecond laser technology, which is used in laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve the problems of limited aperture-depth ratio, low processing efficiency, and reduced processing accuracy, so as to improve processing accuracy and High quality, machining efficiency and precision, and the effect of improving machining efficiency

Inactive Publication Date: 2009-08-12
SUZHOU DELPHI LASER
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Problems solved by technology

Since the light pulse width generated by the nanosecond laser is nanosecond level, the thermal effect is obvious when interacting with the material, and the edge of the hole is not smooth, burnt, chipped, and thermal cracks, etc., resulting in reduced processing accuracy.
In a

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  • Picosecond laser machining apparatus for processing nozzle micropore
  • Picosecond laser machining apparatus for processing nozzle micropore

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Embodiment Construction

[0016] The invention designs a laser microhole processing device, which uses picosecond laser and spiral optical processing system to process the microholes on the fuel injection nozzle. The picosecond laser enters the spiral optical processing system after optical transmission and calibration system, and is controlled by software. The helical optical system focuses the beam for micro-hole processing.

[0017] Such as figure 1 , figure 2 As shown, the picosecond laser processing device for microhole processing of fuel injectors includes a picosecond laser 1, a calibration system 7, and a spiral optical processing system 8. The output end of the picosecond laser 1 is arranged with a first mirror 2, and the second A reflector 2 is connected to the second reflector 3, and the output end of the second reflector 3 is provided with an optical gate 4, and the output end of the optical gate 4 is connected with a beam expander 5, and the output end of the beam expander 5 is connected...

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Abstract

The invention provides a picosecond laser processing device for fuel nozzle microporous processing, which consists of a picosecond laser, a calibrating system and helical optical processing system. An output terminal of the picosecond laser is provided with a first reflecting mirror and the first reflecting mirror is connected with a second reflecting mirror; an output terminal of the second reflecting mirror is provided with an optical gate and an output terminal of the optical gate is connected with a beam extending lens; an output terminal of the beam extending lens is connected with a third reflecting mirror which is connected with the helical optical processing system through the calibrating system. The device is applicable to the fuel nozzle microporous processing and has the advantages of small thermal effect produced in the processing, smooth nozzle edge, no burr on the internal wall and high processing efficiency and accuracy; the diameter of the nozzle can be adjusted and the minimum is up to 60 um; the shape can be ensured to be cylindrical and the diameter depth ratio is up to 1:20, thus greatly increasing the processing accuracy and quality of the nozzle.

Description

technical field [0001] The invention relates to a picosecond laser processing device, which is used for processing microholes on fuel injection nozzles. Background technique [0002] The fuel injector is installed on the cylinder head of the engine, and its function is to atomize the fuel into finer particles, and spray it into the combustion chamber to form a good combustible mixture with the air, thereby improving the combustion efficiency. The fuel injector is composed of the upper injector body and the lower injector nozzle. The high-pressure fuel is ejected from the nozzle through the injector body to form atomized particles. The size of the particles is determined by the fuel pressure and the diameter of the aperture. The quality of the small holes plays a vital role in the ultimate combustion efficiency. Depending on the type of injector, the shape of the small hole is also different. The diameter of the small hole is between 0.15 and 1mm. At present, the diameter o...

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Application Information

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IPC IPC(8): B23K26/00B23K26/36B23K26/382
Inventor 赵裕兴郭良
Owner SUZHOU DELPHI LASER
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