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New preparation method of intermediate alloy for bonding gold wire

An intermediate alloy and bonding wire technology, applied in semiconductor devices, electrical components, circuits, etc., can solve the problems of easy oxidation of micro-alloying elements, fast alloying speed, good dispersibility, etc. Good controllability and improved machinability

Inactive Publication Date: 2009-08-19
SINO PLATINUM METALS CO LTD
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Problems solved by technology

This method can solve the problems of easy oxidation, volatilization, flammability, and damage of microalloy elements. The master alloy obtained by this method is added to the parent metal liquid, and the alloying speed is fast and the dispersion is good. It can be used in high vacuum precision continuous casting During the process, the burning loss of components is controllable, the strengthening elements are evenly distributed, and the ingot structure is uniform

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  • New preparation method of intermediate alloy for bonding gold wire

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Embodiment Construction

[0010] 1. Process

[0011] (1) Material preparation: high-purity gold (≥99.999%) is cast into a billet under vacuum conditions using a high-purity crucible and a mold, and the billet is rolled into a thin strip, heated and boiled with 5% dilute hydrochloric acid for 15 minutes for later use.

[0012] (2) Ingredients: Weigh 99g high-purity gold strip and 1gCa, or 1gBe, or 1gCe, or 1gGa and other microalloying elements (microalloying element purity ≥ 99.95%) for batching. During the process, attention should be paid to pollution and microalloying elements oxidation problem.

[0013] (3) Preparation: Tightly wrap the micro-alloy elements with rolled high-purity gold strips, align them with the quenching tower and the leakage gate, and place them in a vacuum induction melting furnace. Pre-evacuate to 1×10 1 Pa, and filled with inert gas Ar to clean repeatedly, and then evacuated to 1×10 -3 Pa, then filled with argon, and immediately heated up for melting. When the temperature ...

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Abstract

The invention discloses a method for preparing an intermediate alloy for producing a key alloy wire, which comprises the following steps: placing high-purity gold of which the purity is not lower than 5N and micro-alloy element with the adding amount of not more than 1 percent into a vacuum induction melting furnace, introducing a protective gas into the furnace under the high vacuum condition (10Pa), inductively heating the materials by using vacuum intermediate frequency, and quickly chilling the molten alloy at a high temperature by adopting a leakage pouring process to form small granular (similar to ball shape) intermediate alloy. The intermediate alloy prepared by the method has even granular components, does not cause liquation, has no pollution, does not need to process, and is convenient to use. The method for preparing the intermediate alloy for producing the key alloy wire solves the problems of difficult control for burning trace added components and even distribution of alloy elements, and provides a high-quality blank for subsequent processing of superfine wires.

Description

technical field [0001] The invention relates to a preparation method of an intermediate alloy used in the production of bonded gold wires - a slip-casting-chilling method. Background technique [0002] When smelting and casting metal materials, some additive elements are often made into an intermediate alloy with matrix elements, and then added to the matrix for melting and casting. The purpose is to make the alloying of the added elements more complete and the distribution of the added elements more uniform. Less burning loss. The traditional production method of the master alloy is to mix the added elements according to the principle of adding a large amount, and directly fuse with the parent metal to cast into a block, and then analyze the composition of the alloy and roll it into pieces or pieces for use. In non-ferrous metal processing, the common master alloys are Cu-P8~14%, melting point 714~1022℃; Cu-Be3~4%, melting point 864℃; Ni-Mg17% melting point 1082℃; Au-Ge8~1...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22D27/20C22C1/02
CPCH01L2924/01021H01L2924/01047H01L2924/01004H01L2924/01079H01L2924/01018H01L2224/43H01L24/45H01L2924/01006H01L24/43H01L2924/01029H01L2924/0102H01L2924/01205H01L2924/01057H01L2924/01028H01L2224/45144H01L2924/01058H01L2924/01012H01L2924/01031H01L2924/00014H01L2924/00011H01L2224/45H01L2924/013H01L2924/00H01L2224/48H01L2924/00013H01L2924/00012
Inventor 杨国祥孔建稳郭迎春
Owner SINO PLATINUM METALS CO LTD
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