LED radiating substrate and manufacturing method thereof

A technology of heat dissipation substrate and manufacturing method, which is applied in the directions of printed circuit manufacturing, cooling/ventilation/heating renovation, lighting and heating equipment, etc., can solve the problems of welding circuit errors, inconvenient mass production in factories, etc., and achieves extended life and rapid heat dissipation. , the effect of reducing thermal resistance

Inactive Publication Date: 2009-09-16
西安孚莱德光电科技有限公司 +2
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  • Application Information

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Problems solved by technology

Third, the electrical connection welding pads of the LED light source are often in the same shape as the positive and negative electrica

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  • LED radiating substrate and manufacturing method thereof
  • LED radiating substrate and manufacturing method thereof
  • LED radiating substrate and manufacturing method thereof

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[0026] The detailed description and technical content of the present invention are described as follows with the accompanying drawings. However, the accompanying drawings are only provided for reference and illustration, and are not used to limit the present invention.

[0027] The LED heat-dissipating substrate and the manufacturing method thereof of the present invention, the material is selected from the known copper-based copper clad laminate, refer to figure 1 , The copper-based copper clad laminate is divided into a copper-based layer 1, a thermally conductive insulating layer 2, and a copper foil layer 3. The circuit is etched on the copper foil layer 3. The LED heat dissipating substrate of the present invention is a technical transformation of the known copper-based copper clad laminate. according to Figure 8 As shown in the LED light source 13, the welding circuit diagram of the LED light source 13 is designed and etched on the copper foil layer 3 of the copper-based co...

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Abstract

The invention relates to an LED radiating substrate and a manufacturing method thereof. The radiating substrate is used for providing LED light source radiation, reducing heat resistance, enlarging radiating channel and simultaneously providing reliable testing points of working temperature of the LED light source. The radiating substrate is designed according to the LED light source with thermoelectric separation; the radiating substrate adopts a copper base copper-clad plate; all copper foils and heat conducting and insulating layers in a central bonding pad area of the LED are removed; simultaneously a fixed hole is respectively opened at the two sides of the central bonding pad area of the LED and is used for fixing the LED radiating substrate; then a flame retardant layer is printed and tin is plated; and finally an arc-shaped groove is arranged at a position close to the central bonding pad of the LED and is used for measuring junction temperature when the LED light source works. An electric bonding pad of the LED light source adopts different shapes to discriminate the positive electrode and the negative electrode.

Description

technical field [0001] The invention relates to a thermally and electrically separated LED heat dissipation substrate and a manufacturing method thereof, which provides a better heat dissipation channel for the heat dissipation of the LED light source, reduces the thermal resistance between the bottom of the LED light source and the substrate, and increases the thermal conductivity between them In this way, the heat emitted by the LED light source is quickly exported through the copper substrate. At the same time, the invention also provides a relatively reliable and effective method for testing the junction temperature of the LED light source. It really plays the role of rapid heat dissipation, increasing light efficiency and prolonging life. Background technique [0002] Due to the progress and development of LED optoelectronic technology, the brightness has been greatly improved, the service life has been extended, and the production cost has been continuously reduced. Co...

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Application Information

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IPC IPC(8): H05K1/02H05K3/00H05K7/20F21V29/00F21Y101/02F21V29/503F21V29/70F21Y115/10
Inventor 马琳王金龙
Owner 西安孚莱德光电科技有限公司
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