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Method for preparing micro cutter based on focused ion beam technology

A technology of focused ion beams and ion beams, which is applied in the field of micro-tool preparation based on focused ion beam technology, can solve problems such as difficult to achieve complex tool contour processing with nano-scale cutting edge radius, and achieve the effect of avoiding fracture and damage

Inactive Publication Date: 2009-09-30
TIANJIN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical problem of the present invention is: to overcome the shortcomings of the traditional processing method that it is difficult to realize the processing of nano-scale cutting edge radius and complex tool contour, and to use the milling function of the focused ion beam technology to obtain a nano-scale cutting edge with precise feature size. Microtools with arc radii and complex geometries

Method used

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  • Method for preparing micro cutter based on focused ion beam technology
  • Method for preparing micro cutter based on focused ion beam technology
  • Method for preparing micro cutter based on focused ion beam technology

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] The arc-shaped micro-tool processed by the method of the present invention based on the focused ion beam technology, the processing flow chart is shown in image 3 , the specific processing steps are as follows:

[0017] (1) Select a tool blank 3 with a diameter of about 50 μm at the end, the material is cemented carbide, and it is installed on the experimental platform combining the FIB / SEM dual-beam system 1 and the high-precision nano-rotator 5 (see figure 1 );

[0018] (2) Adjust the position of the end of the tool blank 3 to the 19.5 mm working distance of the focused ion beam 2, and then rotate the sample stage 4 so that the incident direction of the ion beam is perpendicular to the processed surface;

[0019] (3) Set the energy of the ion beam as 30KeV, the beam current as 3nA, select the area to be processed on the cylindrical surface of the tool blank, and obtain the rake face of the tool by FIB milling, (see diagram 2-1 ,in diagram 2-1 (a) is a schematic ...

Embodiment 2

[0023] The specific processing steps of the rectangular micro-cutter processed by the method of the present invention based on the focused ion beam technology are as follows:

[0024] (1) Select a tool blank 3 with a terminal diameter less than about 60 μm, the material is polycrystalline diamond (PCD), and it is installed on the experimental platform combining the FIB / SEM dual-beam system 1 and the high-precision nano-rotator 5 (see figure 1 );

[0025] (2) Adjust the position of the end of the tool blank 3 to the 19.5 mm working distance of the focused ion beam 2, and then rotate the sample stage 4 so that the incident direction of the ion beam is perpendicular to the processed surface;

[0026] (3) The energy of the ion beam is set to 30KeV, the beam current is 7nA, the area to be processed is selected on the cylindrical surface of the tool blank, and the rake face of the tool is obtained by FIB milling;

[0027] (4) Rotate the tool 90 degrees clockwise, and adjust the pos...

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Abstract

The invention belongs to the technical field of micromachining of complex micro-nano structures and devices, and relates to a method for processing a micro cutter based on focused ion beam (FIB) technology. The method expands the application of the FIB technology to the processing of the micro cutter, and utilizes the milling function of focused ion beam to process the complex three-dimensional structural micro cutter for cutter blanks of different materials on a designed and constructed experimental platform combining a focused ion beam system and a high-precision rotator. By setting proper focused ion beam processing parameters, precisely controlling an azimuth between the cutter blank and the ion beam incidence direction and inputting different gray level images to precisely control FIB milling, the method can process various complex geometric micro cutters. Compared with other conventional cutter processing methods, the method of the invention has the advantages of high precision, strong repeatability and small stress and strain, can observe on line, is suitable for various materials and geometrical shapes, and the like.

Description

technical field [0001] The invention relates to a method for processing a micro-cutter by using focused ion beam milling technology. The micro-cutter processed by the method can be used for micro-processing of complex micro-nano structures and devices in the fields of ultra-precision processing and micro-processing. Background technique [0002] With the rapid development of micro-miniature systems, the manufacture of some micro-miniature parts and components needs to be processed by micro-tools. Therefore, the manufacturing and processing of micro-tools has become the key to the development of micro-miniature systems and precision systems. At present, micron-scale micro-tools are mainly processed by precision grinding, polishing, wire electrode discharge grinding (WEDG) and other technologies. This invention proposes a new method for processing micro-tools based on focused ion beam technology, which can be processed quickly and accurately. Micro-knives of various materials,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23C3/00B81C5/00B82B3/00
Inventor 房丰洲张少婧徐宗伟胡小唐
Owner TIANJIN UNIV