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Reaction device and electronic equipment

A reaction device and electronic equipment technology, applied in the direction of fuel cell additives, fuel cell components, etc., can solve problems such as temperature rise of the main body of the reaction device, temperature rise, and inability to maintain the reaction temperature

Inactive Publication Date: 2009-09-30
CASIO COMPUTER CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] However, in such a heat-insulating container, if the heat conduction from the reaction apparatus main body to the heat-insulating container is suppressed, the temperature of the reaction apparatus main body may rise and an appropriate reaction temperature may not be maintained.
On the other hand, in order to avoid such a problem, for example, when the heat conduction from the reactor main body to the heat insulating container is increased, the temperature of the external electronic equipment having the reactor main body may be raised.

Method used

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  • Reaction device and electronic equipment
  • Reaction device and electronic equipment
  • Reaction device and electronic equipment

Examples

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no. 1 approach

[0052] figure 1 It is a schematic diagram which shows the structure of 10 A of reaction apparatuses concerning 1st Embodiment of this invention. Such as figure 1As shown, the reaction device 10A includes a reaction device main body 11 and a heat-insulating container (first container) 20 for accommodating the reaction device main body 11 . The reaction device 10A can be formed, for example, by bonding metal plates such as stainless steel (SUS304), Kovar, or nickel-based alloys, or by bonding optical materials or glass substrates.

[0053] A radiation prevention film 11a for preventing radiation is provided on the outer wall surface of the reaction device main body 11 in addition to portions provided with radiation heat dissipation films 13a and 15a to be described later. As the material of the radiation prevention film 11a, the same material as that of the reflective film 21a described later can be used. The transfer of heat to the outside of the reaction device 10A due to r...

Deformed example 1

[0097] Figure 6 is a schematic diagram showing the structure of a reaction apparatus 10B according to a first modified example of the present invention, Figure 7 yes Figure 6 View from direction VII. In addition, the same code|symbol is attached|subjected to the last two digits about the structure similar to 1st Embodiment, and description is abbreviate|omitted.

[0098] In the reaction device of this modified example, the radiation heat dissipation film 14a is provided on the second connection part 14, and the radiation transmission window 24 is provided on the part of the heat insulating container 20 opposite to the radiation heat dissipation film 14a, so that the radiation heat dissipation in the high temperature reaction part 15 is not performed. , while radiation heat dissipation is performed at the second connecting portion 14 . In this case, when the heat of reaction in the high-temperature reaction part 15 and the heat transfer with the circulating gas are set as...

Deformed example 2

[0108] Figure 8 It is a schematic diagram which shows the structure of 10 C of reaction apparatuses concerning the 2nd modification of this invention. In addition, the same code|symbol is attached|subjected to the last two digits about the structure similar to 1st Embodiment, and description is abbreviate|omitted.

[0109]In the reaction device of this modified example, a radiation heat dissipation film 12a is provided at the part between the low temperature reaction part 13 of the first connection part 12 and the heat insulation container 20, and a radiation transmission window is provided at the part of the heat insulation container 20 opposite to the radiation heat dissipation film 12a. 24 , so that radiation heat dissipation is not performed at each reaction portion 13 , 15 , but radiation heat dissipation is performed at the first connection portion 12 . In this case, when Q RA , set the heat balance in the low temperature reaction part 13 as Q RB , The heat dissipati...

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Abstract

The present invention relates to a reaction device and electronic equipment, wherein, the reaction device includes: a reaction device body including a reaction section in which a reactant reacts; and a first container to house the reaction device body, wherein the first container includes a radiation transmitting region through which radiation from the reaction device body transmits.

Description

technical field [0001] The present invention relates to reaction devices and electronic equipment used in fuel cell devices and the like. Background technique [0002] A fuel cell is a device that electrochemically reacts fuel and oxygen in the air to directly extract electrical energy from chemical energy. [0003] When using liquid fuels such as alcohols and gasoline as fuels used in fuel cells, a gasifier that vaporizes the liquid fuel is required; a gasifier that takes out the hydrogen required for power generation by reacting the gasified fuel with high-temperature water vapor a reformer; and a carbon monoxide remover that removes carbon monoxide that is a by-product of the reforming reaction, and the like. [0004] Since the operating temperatures of these vaporizers and carbon monoxide removers are high temperatures, for example, in Japanese Patent Application Laid-Open No. 2004-303695, a high-temperature body storage device serving as a heat-insulating container is ...

Claims

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Application Information

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IPC IPC(8): H01M8/04H01M8/02
CPCY02E60/521Y02E60/50Y02E60/525
Inventor 寺崎努远藤元气石川哲史中村修盐谷雅治
Owner CASIO COMPUTER CO LTD