Copper clad base plate and preparation method thereof

A technology of copper clad substrate and copper foil, which is applied in the direction of circuit substrate materials, printed circuit components, etc., can solve the problems of reducing the peeling strength of copper clad laminate copper foil, poor heat resistance, etc., and achieve improved reliability and electrical performance of the substrate The effect of lowering and lowering the coefficient of thermal expansion

Active Publication Date: 2011-04-13
无锡宏仁电子材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Aluminum hydroxide has an excellent flame retardant effect, but its heat resistance is poor, and it will also reduce the copper foil peel strength of the copper clad laminate

Method used

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  • Copper clad base plate and preparation method thereof
  • Copper clad base plate and preparation method thereof

Examples

Experimental program
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Embodiment Construction

[0028] 1, specific embodiment formula

[0029] Embodiment 1 XUS19074 (the epoxy resin produced by Dow Chemical, possesses Tg of 170° C. after curing) 49.5%, curing agent 3363 (novolac resin produced by Hansen) 16.5%, propylene glycol methyl ether 22.0%, curing accelerator 0.3% of 2-ethyl-4-methylimidazole, 11.7% of G2-C (composite quartz powder produced by Sibick Company).

[0030] Embodiment 2 (comparative example) XUS19074 (an epoxy resin produced by Dow Chemical, with a Tg of 170°C after curing) 49.5%, curing agent 3363 (novolac resin produced by Hansen) 16.5%, propylene glycol methyl ether 22.0% , curing accelerator 2-ethyl-4-methylimidazole 0.3%, 925 (Silica produced by Sibic Corporation) 11.7%.

[0031] Embodiment 3 (comparative example) XUS19074 (an epoxy resin produced by Dow Chemical, with a Tg of 170°C after curing) 49.5%, curing agent 3363 (novolac resin produced by Hansen) 16.5%, propylene glycol methyl ether 22.0% , curing accelerator 2-ethyl-4-methylimidazole 0...

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PUM

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Abstract

The invention discloses a copper clad base plate and a preparation method thereof. The copper clad base plate is formed by pressing prepreg and copper clad and adding compound quartz powder functioning as inorganic filler to glue solution made of the prepreg, wherein the weight of the compound quartz powder occupies 5-50 percent of the total weight of the glue solution. The preparation method of the copper clad base plate comprises the following steps: (1) under the room temperature, respectively adding base raw materials for preparing the glue solution to a dispensing container and mixing the base raw materials, adding the compound quartz powder functioning as inorganic filler to the mixture and mixing with the same for 6h, sampling the gel time of the test glue solution and controlling the time between 200s and 300s; (2) making adhesive plaster impregnated with the glue solution pass through a vertical or horizontal impregnating machine, and preparing the prepreg by controlling windtemperature and furnace temperature; and (3) pressing: after combining the cut prepreg with the copper clad, the cut prepreg and the copper clad are put into a vacuum hot press to be pressed for obtaining the copper clad base plate. The invention can greatly lower the cost of the glue solution, lower the coefficient of heat expansion of the product, improve the reliability of the copper clad baseplate in the preparation of printed circuit boards, and ensure the improvement on the mechanical property and the electric property of the product.

Description

technical field [0001] The invention relates to a copper-clad substrate used in the printed circuit board industry and a preparation method thereof, mainly relates to a copper-clad substrate made of glass fiber-based epoxy resin, and is suitable for improving the characteristics of various types of copper-clad laminates. Background technique [0002] According to the classification of copper clad laminates (that is, copper clad substrates) according to the printed circuit handbook (edited by Coombs, 3rd edition, published by McGraw-Hill Book Co. in 1988), it is divided into For FR-2, FR-3, FR4, CEM-1, etc. FR-2 refers to paper-based phenolic resin to make copper-clad laminates, FR-3 refers to paper-based epoxy resin to make copper-clad laminates, and FR-4 refers to glass fiber-based epoxy resin to make copper-clad laminates. [0003] Adding fillers to composite materials such as copper clad laminates as fillers and flame retardants has been proposed earlier. The addition o...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/03C08L101/00C08K3/36C08K3/22C08K3/38C08L63/00
Inventor 李海民施忠仁郭永军周宁冯于
Owner 无锡宏仁电子材料科技有限公司
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