Copper clad base plate and preparation method thereof
A technology of copper clad substrate and copper foil, which is applied in the direction of circuit substrate materials, printed circuit components, etc., can solve the problems of reducing the peeling strength of copper clad laminate copper foil, poor heat resistance, etc., and achieve improved reliability and electrical performance of the substrate The effect of lowering and lowering the coefficient of thermal expansion
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[0028] 1, specific embodiment formula
[0029] Embodiment 1 XUS19074 (the epoxy resin produced by Dow Chemical, possesses Tg of 170° C. after curing) 49.5%, curing agent 3363 (novolac resin produced by Hansen) 16.5%, propylene glycol methyl ether 22.0%, curing accelerator 0.3% of 2-ethyl-4-methylimidazole, 11.7% of G2-C (composite quartz powder produced by Sibick Company).
[0030] Embodiment 2 (comparative example) XUS19074 (an epoxy resin produced by Dow Chemical, with a Tg of 170°C after curing) 49.5%, curing agent 3363 (novolac resin produced by Hansen) 16.5%, propylene glycol methyl ether 22.0% , curing accelerator 2-ethyl-4-methylimidazole 0.3%, 925 (Silica produced by Sibic Corporation) 11.7%.
[0031] Embodiment 3 (comparative example) XUS19074 (an epoxy resin produced by Dow Chemical, with a Tg of 170°C after curing) 49.5%, curing agent 3363 (novolac resin produced by Hansen) 16.5%, propylene glycol methyl ether 22.0% , curing accelerator 2-ethyl-4-methylimidazole 0...
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