Method for manufacturing a semiconductor device, method and structure for mounting the semiconductor device
An installation method and a semiconductor technology, which are applied in semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc., can solve the problems of reduced productivity of semiconductor devices, reduced connection reliability, and low elastic rate, so as to improve connection Reliability, suppression of disconnection, and productivity improvement effects
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[0041] One embodiment of the invention will be described below with reference to the drawings.
[0042] First, the semiconductor device 1 of the present invention will be described. figure 1 (a) is a plan view of main parts of the semiconductor device 1 of the liquid crystal display device. and, figure 1 (b) is figure 1 A-A line sectional view in (a), figure 1 (c) is figure 1 B-B line sectional view in (a).
[0043] Such as figure 1 (a)~ figure 1 As shown in (c), in the semiconductor device 1 , a plurality of electrodes 3 are formed on the semiconductor substrate 2 . Each electrode 3 is an electrode for inputting and outputting electric signals, and includes an electrode pad 3 a and a wiring 3 b connected to the electrode pad 3 a. In this embodiment, a plurality of electrodes 3 are formed near the edge of the semiconductor substrate 2 at a predetermined pitch, and the material of each electrode 3 is aluminum.
[0044] Also, these electrodes 3 are covered with a protec...
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