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Silver alloy bonding wire for packing wires and manufacturing method thereof

A silver alloy soldering and manufacturing method technology, which is applied in semiconductor/solid-state device manufacturing, manufacturing tools, welding equipment, etc., can solve the problems of increased cost and high cost of semiconductor components, and achieve the effect of reducing costs

Inactive Publication Date: 2009-11-04
李俊德
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Metal bonding wires made of pure gold have better physical properties such as ductility and electrical conductivity. However, due to the high cost of metal bonding wires made of pure gold, it also increases the overall cost of semiconductor components.

Method used

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  • Silver alloy bonding wire for packing wires and manufacturing method thereof
  • Silver alloy bonding wire for packing wires and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] The main metal raw materials with silver components are put into a vacuum furnace for smelting and manufacturing, and secondary metal materials such as gold and copper are added into the vacuum furnace, and trace metal materials such as beryllium and aluminum are also added for mixing and deployment. Then, the vacuum furnace Silver alloy ingots are produced by mixing and smelting. The composition of the silver alloy ingot comprises: 98.659% by weight of silver, 0.50% by weight of gold, 0.84% ​​by weight of copper, 0.0008% by weight of beryllium, and 0.0002% by weight of aluminum.

[0028] The silver alloy ingot was continuously cast to draw a silver alloy wire having a wire diameter of 6 mm. The silver alloy wire is coiled by a winder, and the composition analysis of the silver alloy wire is carried out.

[0029] After the silver alloy wire casting is completed, the wire diameter is stretched, so that the wire diameter that was originally 6mm is stretched to 3mm throug...

Embodiment 2

[0032] The main metal raw materials with silver components are put into a vacuum furnace for smelting and manufacturing, and secondary metal materials such as gold and copper are added into the vacuum furnace, and trace metal materials such as beryllium and aluminum are also added for mixing and deployment. Then, the vacuum furnace Silver alloy ingots are produced by mixing and smelting. The composition of the silver alloy ingot comprises: 99.99% by weight of silver, 0.005% by weight of gold, 0.003% by weight of copper, 0.001% by weight of beryllium, and 0.001% by weight of aluminum.

[0033] The silver alloy ingot was continuously cast to draw a silver alloy wire having a wire diameter of 6 mm. The silver alloy wire is coiled by a winder, and the composition analysis of the silver alloy wire is carried out.

[0034] After the casting of the silver alloy wire rod is completed, the wire diameter is stretched so that the original wire diameter of 6 mm is stretched to 3 mm throu...

Embodiment 3

[0037] The main metal raw materials with silver components are put into a vacuum furnace for smelting and manufacturing, and secondary metal materials such as gold and copper are added into the vacuum furnace, and trace metal materials such as beryllium and aluminum are also added for mixing and deployment. Then, the vacuum furnace Silver alloy ingots are produced by mixing and smelting. The composition of the silver alloy ingot comprises: 95% by weight silver, 1.25% by weight gold, 1.25% by weight copper, 1.25% by weight beryllium, and 1.25% by weight aluminum.

[0038] The silver alloy ingot was continuously cast to draw a silver alloy wire having a wire diameter of 6 mm. The silver alloy wire is coiled by a winder, and the composition analysis of the silver alloy wire is carried out.

[0039] After the silver alloy wire casting is completed, the wire diameter is stretched, so that the original wire diameter of 6mm is stretched to 3mm through the first thick wire drawing ma...

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Abstract

The invention provides a manufacturing method of a silver alloy bonding wire for packing wires, comprising the following steps: preparing main metal materials containing silver component; feeding the main metal materials into a vacuum smelting furnace for smelting and adding a plurality of secondary metal materials in the vacuum smelting furnace to manufacture silver alloy ingots; stretching the silver alloy ingots into silver alloy wires; and finally stretching the silver alloy wires into silver alloy bonding wires with predetermined diameter. The invention further provides a silver alloy bonding wire for packing wires, comprising the following components according to weight percentage: 90.00 to 99.99 percent of silver component, 0.0001 to 9.9997 percent of gold component, and 0.0001 to 9.9997 percent of copper component. The silver alloy bonding wire prepared by a plurality of metal raw materials not only achieves the effect of the metal bonding wire made of pure gold, but also greatly reduces cost.

Description

technical field [0001] The invention relates to a metal bonding wire, in particular to a silver alloy bonding wire used in semiconductor packaging technology and a manufacturing method thereof. Background technique [0002] In the packaging process of semiconductor components, the metal bonding wire is often connected to the chip and the circuit substrate by wire bonding, and the chip and the circuit substrate are electrically connected by the metal bonding wire to serve as signal and current transmission between the chip and the circuit substrate. path. [0003] Generally speaking, the main characteristics of metal bonding wires, such as load strength, ductility, bending, melting point, electrical properties, hardness, and welding ability to integrated circuit (IC) chips, are related to the materials used. The above characteristics will affect the life and stability of the semiconductor device. Depending on the shape of the chip and the circuit substrate, the specificatio...

Claims

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Application Information

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IPC IPC(8): B23K35/40B21C1/00B23K35/30H01L21/48H01L23/49
CPCH01L2924/01033H01L2924/01005H01L2924/01006H01L2924/01029H01L24/45H01L2924/01082H01L24/43H01L2924/01047H01L2924/01004H01L2924/01079H01L2224/45139H01L2924/01013H01L2224/43H01L2924/00014H01L2224/45015H01L2224/43848H01L2924/14H01L2924/00011H01L2224/45H01L2924/013H01L2924/00H01L2224/48H01L2924/01049H01L2924/00012H01L2924/20751H01L2924/20752H01L2924/20753H01L2924/20754H01L2924/20755
Inventor 李俊德
Owner 李俊德