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Pressure-sensitive adhesive tape for the protection of photo masks

A technology of adhesive tape and photomask, which is applied in the direction of originals for photomechanical processing, adhesives, film/sheet adhesives, etc., which can solve the problem of insufficient bonding ability of the release layer, machine stop, and difficult and other problems, to achieve the effect of excellent re-peelability, improved adhesion, and good durability

Active Publication Date: 2012-03-28
SEKISUI CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in order to express the functionality of the liquid solder resist, most adhesive types are used, so there is a problem that the photoresist adheres to the surface of the adhesive tape for protecting the photomask, and it is difficult to remove the solder resist after exposure. Difficulty stripping the photomask from the resist so that the machine stops
[0004] In addition, since the release layer of the adhesive tape for protecting photomasks with a release agent layer has insufficient bonding ability, when the pollutants attached to the surface are cleaned with a solvent such as alcohol, it will also cause release. The problem of layer peeling and unsustainable release effect

Method used

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  • Pressure-sensitive adhesive tape for the protection of photo masks
  • Pressure-sensitive adhesive tape for the protection of photo masks
  • Pressure-sensitive adhesive tape for the protection of photo masks

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0153] Dilute an isocyanate-crosslinked acrylic adhesive ("SKDyne 1425" manufactured by Soken Chemical Co., Ltd.) with toluene to a solid content concentration of 10% by weight, and apply it to a separator (manufactured by LINTEC Corporation) with a thickness of 25 μm. ) after drying at 120°C for 30 seconds, thereby setting an adhesive layer with a thickness of 5 μm after drying, wherein the separator is formed on one side of the PET base material with a silicone release layer Partition of the agent layer. Subsequently, the above-mentioned adhesive layer was laminated on a biaxially oriented transparent PET base material film ("F53#6C" manufactured by Toray Corporation) having a thickness of 6 µm to prepare an adhesive tape.

[0154] Subsequently, corona treatment was performed on the surface of the transparent PET base material of the above-mentioned adhesive tape using "Mixed Solution No. 48.0 for Surface Wetting Tension Test" manufactured by Wako Pure Chemical Industries, L...

Embodiment 2

[0156] On the upper surface of the adhesive tape made by corona treatment in the same manner as in Example 1, an intermediate layer was provided as follows: Silicone resin (Silicone Resin, Toray Dowcorning Co., Ltd.) was used as a silicone resin with MEK A mixture of 60 parts by weight of "SR2410" manufactured by the company and 40 parts by weight of a methylol-type methylated melamine resin ("Cymel 370" manufactured by Mitsui Cytec Corporation) as a melamine resin was diluted to a solid content concentration of 5% by weight and After coating, drying was carried out at 130° C. for 120 seconds to obtain an intermediate layer having a thickness of 0.1 μm after drying and composed of a silicone-based resin and a melamine-based resin.

[0157] On the upper surface of the above intermediate layer, an adhesive tape for protecting a photomask was prepared as follows: 80 parts by weight of methyl triisocyanate (manufactured by Matsumoto Pharmaceutical Co., Ltd. "SI-310") with ethyl ace...

Embodiment 3

[0159] 60 parts by weight of silicone resin ("SR2410" manufactured by Toray Dowcorning Co., Ltd.) and methyl and n-butyl mixed etherified benzoguanamine (manufactured by Sanwa Chemical Co., Ltd.) "Nikalac BX-4000") 40 parts by weight of the mixture was diluted to a solid content concentration of 5% by weight and coated, and then dried at 130°C for 120 seconds to obtain a protective film with a thickness of 0.1 μm after drying. Adhesive Tape for Photomask Except for this, an adhesive tape for protecting a photomask was produced in the same manner as in Example 2. The evaluation results are shown in Table 1.

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Abstract

The invention provides a pressure-sensitive adhesive tape for the protection of photo masks which is not deteriorated in peelability even after it has been repeatedly used in a state adhering closely to photo resists having pressure-sensitive adhesion properties and thus permits repeated use. A pressure-sensitive adhesive tape for the protection of photo masks which comprises a transparent substrate film or sheet (A), a pressure-sensitive adhesive layer (B) formed on one side of the film or sheet (A), and a face layer (C) formed on the other side thereof, wherein the face layer (C) is made ofa specific product obtained by curing a mixture comprising both an isocyanate silane (x) and a siloxane (y) having a hydroxyl group at the end.

Description

technical field [0001] The present invention relates to an adhesive tape for protecting a photomask, and more particularly, to an adhesive tape for protecting a photomask which can be used in a process of forming a printed substrate and protects a photomask. Even when the adhesive tape is bonded to an adhesive photoresist and used repeatedly, it can be used without reducing the peelability. Background technique [0002] Photoresists such as liquid solder resists are used in the manufacture of printed wiring boards. In order to protect the photomask for exposure used to bond the photoresist from surface contamination, scratches, etc., an adhesive tape for protecting the photomask made of a polyester base material has conventionally been used. However, in order to express the functionality of the liquid solder resist, most adhesive types are used, so there is a problem that the photoresist adheres to the surface of the adhesive tape for protecting the photomask, and it is dif...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F1/48C09J7/02C09J7/35
CPCG03F7/2014C09J7/0203C09J2483/00C09J2475/00G03F1/48C09J7/35C09J2203/326
Inventor 多田博士神谷信人
Owner SEKISUI CHEM CO LTD
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