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Electronic component

A technology of electronic components and device chips, applied in the direction of electrical components, electric solid devices, circuits, etc., can solve the problems of low viscosity and difficulty in miniaturization of electronic components, and achieve high air tightness

Inactive Publication Date: 2009-12-09
TAIYO YUDEN KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the viscosity of the SOG oxide film 62 is low, so when the device chip 20 is sealed, the SOG oxide film 62 may reach the surface of the working area 22
exist Figure 4 In the technique of Patent Document 5 shown, since the pattern 32 is provided, it is difficult to miniaturize electronic components.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] Figure 5 (a) is a sectional view of the electronic component of Example 1. refer to Figure 5(a), the wiring pattern 12 is provided on the upper surface of the insulating substrate 10 made of ceramics or the like. The lower surface of the insulating substrate 10 is provided with external connection terminals 16 . Internal wiring 14 connecting the wiring pattern 12 and the external connection terminal 16 is provided inside the insulating substrate 10 . A device chip 20 having an active region 22 on a lower surface is mounted on the insulating substrate 10 in a flip-chip manner. That is, the device chip 20 is connected to the wiring pattern 12 via the bump 28 . A pattern 32 is provided on the insulating substrate 10 with a gap between its upper surface and the lower surface of the device chip 20 . SOG oxide film 30 is provided to cover side surfaces of device chip 20 and pattern 32 . And, the SOG oxide film 30 is formed so as to be embedded in the gap between the u...

Embodiment 2

[0054] Embodiment 2 is an example in which a metal film is provided on the outer periphery of the lower surface of the device chip. Figure 9 (a) is a sectional view of the electronic component of Example 2. Figure 9 (b) is a view in which the device chip 20 , the metal film 24 of Cu or Au, and the pattern 32 are seen through from the upper surface of the electronic component of the first embodiment. refer to Figure 9 (a), the metal film 24 is provided on a region of the lower surface of the device chip 20 opposite to the upper surface of the pattern 32 . The lower surface of metal film 24 is covered with SOG oxide film 30 . refer to Figure 9 (b), the metal film 24 is provided in a ring shape along the outer periphery of the device chip 20 . The metal film 24 may not be formed on a part of the outer periphery of the device chip 20 . Other structure and embodiment 1 Figure 5 (a) and Figure 5 (b) is the same, and the explanation is omitted.

[0055] According to Emb...

Embodiment 3

[0057] Embodiment 3 is an example in which driven elements are provided on an insulating substrate. Figure 10 It is a sectional view of the electronic component of Example 3. refer to Figure 10 , a driven element 34 is formed on the insulating substrate 10 opposite to the lower surface of the device chip 20 . The driven element 34 is isolated from the lower surface of the device chip 20 . As the driven element 34 , for example, an inductor formed of metal such as Cu, an MIM (Metal Insulator Metal: Metal Insulator Metal) capacitor formed by laminating a metal film, an insulating film, and a metal film, or the like can be provided. In this way, at least one of capacitance and inductance can be provided as the driven element 34 .

[0058] Electronic components can be miniaturized by forming the driven element 34 between the device chip 20 and the insulating substrate 10 . However, since SOG easily flows into the void 26 because the height of the void 26 is large, it is effe...

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Abstract

The present invention provides an electronic component which can seal with higher air tightness and can realize miniaturization. The electronic component of the invention comprises the following components: an insulating substrate (10); a device chip (20) which is equipped on the insulating substrate (10) with a reverse mode; a pattern (32) which is equipped on the insulating substrate (10) along the side surface of the device chip (20) with a mode that a clearance is provided between the upper surface of the pattern (32) and the lower surface of the device; and an SOG oxide film (30) which covers the side surface of the device chip (20) and the pattern (32) with a mode that the SOG oxide film is inserted into the clearance between the upper surface of the pattern (32) and the lower surface of the device chip (20) and a clearance (26) is formed between the upper surface of the insulating substrate (10) and the lower surface of the device chip (20).

Description

technical field [0001] The present invention relates to electronic components, in particular to electronic components in which device chips are flip-chip mounted on an insulating substrate. Background technique [0002] Device chips that vibrate in the working area, such as SAW (Surface Acoustic Wave) filters and FBAR (Film Bulk Acoustic Resonator: Film Bulk Acoustic Resonator) filters, are mounted so that the vibrations are not suppressed. Therefore, mount to the package in such a way that the active area of ​​the device chip surface meets the void. [0003] figure 1 It is a figure for demonstrating the electronic component described in patent document 1 and 2. refer to figure 1 , the wiring pattern 12 , the internal wiring 14 and the external connection terminal 16 are provided on the bottom surface of the package substrate 70 having the cavity 78 . The device chip 20 is flip-chip mounted on the wiring pattern 12 using bumps 28 . The package substrate 70 is covered wi...

Claims

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Application Information

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IPC IPC(8): H01L23/14H01L23/29H01L23/31H01L23/48H01L25/03H03H9/25
CPCH01L24/97H01L2224/16225
Inventor 横山刚宓晓宇原基扬上田政则上田知史高桥岳雄
Owner TAIYO YUDEN KK
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