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Halogen-free ethoxyline resin antiflaming bonding adhesive and adhesive film thereof

A technology of flame retardant adhesives and halogen epoxy resins, applied in the direction of epoxy resin adhesives, adhesives, adhesive types, etc., can solve the problems of poor heat resistance, general adhesion, and environmental impact of cured products, and achieve good results. Effects of heat resistance, superior adhesive performance, and good flame-retardant durability

Active Publication Date: 2009-12-16
靖江亚星进出口有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The above-mentioned flame retardant adhesive is based on epoxy resin, among which brominated bisphenol A epoxy resin can achieve flame retardant effect, but because it contains halogen, it has an impact on environmental protection, and the adhesiveness of the composition is general; in addition, although the The nitrile rubber modified epoxy resin contained in the composition can act as a toughening agent, but the cured product of the film has poor heat resistance

Method used

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  • Halogen-free ethoxyline resin antiflaming bonding adhesive and adhesive film thereof
  • Halogen-free ethoxyline resin antiflaming bonding adhesive and adhesive film thereof

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[0020] The preparation process of the halogen-free epoxy resin flame-retardant adhesive of the present invention is as follows:

[0021] (1) Dissolve nitrile rubber in a solvent, then mix various epoxy resins in proportions and add them, and stir at 40-60°C to make a solution;

[0022] (2) The solution in step (1) is heated to 70-80°C, stirred for 2-4 hours, and then cooled to 45°C, and a curing agent and a curing accelerator are added.

[0023] Follow steps (1) and (2) to prepare halogen-free epoxy resin flame retardant adhesive.

[0024] A halogen-free heat-resistant adhesive film includes a release paper and a flame-retardant adhesive coated on the release paper, wherein the flame-retardant adhesive is the flame-retardant adhesive of the present invention.

[0025] The binder for forming a halogen-free heat-resistant adhesive film, including 100 parts by weight of epoxy resin, 35-50 parts by weight of nitrile rubber, 8-15 parts by weight of curing agent, 0.5-2.0 parts by weight...

Embodiment 1

[0036] 35 parts of carboxyl-terminated nitrile rubber (commodity model 1072c, produced by Zeon Corporation, acrylonitrile content 27%wt, carboxyl content 3.4%wt), hydrogenated nitrile rubber (commodity model: 2020, produced by Zeon Corporation Japan, carboxyl Content 3.5%wt) 10 parts are mixed and dissolved in 180 parts of methyl ethyl ketone solvent; then phosphorus-containing epoxy resin (commodity model E-2175, produced by Wuxi Akoli Chemicals, phosphorus content 3.5%wt, epoxy equivalent 320) 50 parts, bisphenol A epoxy resin (model E51, produced by Wuxi Resin Factory, epoxy equivalent 275) 20 parts, phenolic epoxy resin (commodity model DEN438, produced by The Dow Chemical Company, epoxy equivalent 180, ring Oxygen functionality 3.6) 30 parts were mixed and added to the above mixture, stirred at 40 ℃ for 2 hours to make a solution; the above solution was heated to 70 ℃, stirred for 3 hours and then cooled to 45 ℃, add 10 parts of curing agent DDM and The curing accelerator is ...

Embodiment 2

[0039] 35 parts of carboxyl-terminated nitrile rubber (commodity model 1072c, produced by Zeon Corporation, acrylonitrile content 27%wt, carboxyl content 3.4%wt), hydrogenated nitrile rubber (commodity model: 2020, produced by Zeon Corporation Japan, carboxyl Content 3.5%wt) 8 parts are mixed and dissolved in 170 parts of methyl ethyl ketone solvent; then phosphorus-containing epoxy resin (commodity model E-2175, produced by Wuxi Akoli Chemicals, phosphorus content 3.5%wt, epoxy equivalent 320) 60 parts, 15 parts of bisphenol A epoxy resin (model E51, produced by Wuxi Resin Factory, epoxy equivalent 275), phenolic epoxy resin (commodity model DEN438, produced by The Dow Chemical Company, epoxy equivalent 180, ring Oxygen functionality 3.6) 25 parts were mixed and added to the above mixture, stirred at 50 ℃ for 1.5 hours to make a solution; the above solution was heated to 75 ℃, stirred for 2 hours and then cooled to 45 ℃, add 8 parts of curing agent DDE and The curing accelerator ...

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Abstract

The invention provides a halogen-free ethoxyline resin antiflaming bonding adhesive comprising the following components according to the parts by weight: 100 ethoxyline resin, 35-50 nitrile rubber containing carboxyl, 8-15 curing agent and 0.5-2.0 curing accelerating agent. The halogen-free ethoxyline resin antiflaming bonding adhesive has excellent adhesive property, heat resistance and stable normal temperature storage and is suitable for bonding agents for the encapsulation of electric circuits.

Description

Technical field [0001] The invention relates to an epoxy resin flame-retardant adhesive and its adhesive film for electronic circuit assembly, in particular to a halogen-free heat-resistant epoxy resin flame-retardant adhesive and its adhesive film. Background technique [0002] Epoxy resin packaging materials currently used in electronic circuits, such as semiconductors, circuit boards and other packaging materials and adhesives in electronic materials, require flame-retardant properties. In order to have excellent flame retardancy, bromine-containing epoxy resin or similar flame retardant substances are usually included. However, such halogen-containing compounds, such as bromine compounds, will produce corrosive gas smoke containing hydrogen bromide when burned; in addition, brominated epoxy resins may also produce toxic brominated dioxene (dioxin) furans when burned. Substances are not conducive to environmental protection requirements. In view of this, the demand for halogen...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J9/00C09J11/06C09J109/02
Inventor 杨志祥张文娟
Owner 靖江亚星进出口有限公司
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