Quantity production packaging technique of minitype OLED display

A packaging process and display technology, which is used in the manufacture of electrical solid devices, semiconductor devices, semiconductor/solid state devices, etc. The effect of reducing the packaging cost and improving the strength of the bonding wire

Active Publication Date: 2009-12-23
YUNNAN NORTH OLIGHTEK OPTO ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] At present, metal lids and glass lids are mainly packaged with groove bonding, but the packaging cost

Method used

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  • Quantity production packaging technique of minitype OLED display
  • Quantity production packaging technique of minitype OLED display
  • Quantity production packaging technique of minitype OLED display

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0022] Such as figure 1 As shown, follow the steps below to encapsulate the micro OLED display

[0023] The first step is to vibrate and heat glue on the display chip on the silicon wafer, and bond the glass cover sheet.

[0024] The 8-inch silicon wafer (1) covered with the display chip (2) is placed on the hot plate of the glue applicator. The temperature of the hot plate is 65° C., and it is heated for 5 minutes to make the temperature uniform. The bonding glue uses Dow Corning Sylgard-182, which is a transparent high-strength bonding silica gel. Mix the Curing agent into the Base according to the weight ratio of 1:10, use the glue tank to mix thoroughly, and then put it into the glue dispenser of the glue applicator, adjust the glue output to 15mg / small piece, carry out vibration glue coating, glue coating At the same time, the strengthened glass cover sheet (4) is bonded, and the glass cover sheet (4) adopts K9 glass that has undergone surface smoothing treatment and stress ...

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Abstract

The invention relates to a packaging technique of an organic electro luminescent display, which is a quantity production packaging technique of a minitype OLED luminescent display. The invention specifically comprises the following techniques: step 1, vibrating thermocementing is carried out on a display chip of a silicon chip, and a square toughened glass upper cover is covered; step 2, the display chip covered by the toughened glass is cut into display chip units which are then cleaned; step 3, the display chip units are interconnected with a PCB and wires are welded; step 4, a cofferdam frame is bonded at the periphery of the welded wire; and step 5, the cofferdam frame is added with glue and then heated and cured. The packaging technique can improve the packaging strength of the display, has good thermal shock resistance, effectively reduces packaging cost and improves the packaging efficiency.

Description

technical field [0001] The invention relates to the field of organic electroluminescent displays, in particular to a packaging process for organic electroluminescent displays. Background technique [0002] OLED (Organic Light-Emitting Diode, Organic Light-Emitting Diode) is the third-generation display technology after CRT and LCD. [0003] Micro-displays are generally less than 1 inch in size, can use optical magnification to present a huge picture, and can realize 3D display. Have very good portability. There are currently 26 companies producing micro-displays in the world, but they mainly use LCD technology to produce micro-displays. [0004] The silicon-based top-emitting miniature high-resolution organic light-emitting display developed by using the mature COMS process combined with advanced OLED technology has great application value in consumer electronics, industry, military and other fields. [0005] At present, metal lids and glass lids are mainly packaged with ...

Claims

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Application Information

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IPC IPC(8): H01L51/56H01L51/52
Inventor 李竑志季华夏
Owner YUNNAN NORTH OLIGHTEK OPTO ELECTRONICS TECH
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